H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITSRESONATORS measuring, testing G01R; arrangements for producing a reverberation or echo sound G10K15/08; impedance networks or resonators consisting of distributed impedances, e.g. of the waveguide type, H01P; control of amplification, e.g. bandwidth control of amplifiers, H03G; tuning resonant circuits, e.g. tuning coupled resonant circuits, H03J; networks for modifying the frequency characteristics of communication systems H04B This subclass covers : networks comprising lumped impedance elements;networks comprising distributed impedance elements together with lumped impedance elements;networks comprising electromechanical or electro-acoustic elements;networks simulating reactances and comprising discharge tubes or semiconductor devices;constructions of electromechanical resonators. In this subclass, the following expression is used with the meaning indicated: "passive elements" means resistors, capacitors, inductors, mutual inductors or diodes.Attention is drawn to the Notes following the titles of class B81 and subclass B81B relating to "microstructural devices" and "microstructural systems".In this subclass, main groups with a higher number take precedence.In this subclass non-limiting references (in the sense of paragraph 39 of the Guide to the IPC) may still be displayed in the scheme. H03H1/00 H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network constructional details of electromechanical transducers H03H9/00 H03H1/0007of radio frequency interference filters H03H2001/0014Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter H03H2001/0021Constructional details H03H2001/0028RFI filters with housing divided in two bodies H03H2001/0035Wound magnetic core H03H2001/0042Wound, ring or feed-through type capacitor H03H2001/005Wound, ring or feed-through type inductor H03H2001/0057comprising magnetic material H03H2001/0064comprising semiconductor material H03H2001/0071comprising zig-zag inductor H03H2001/0078comprising spiral inductor on a substrate H03H2001/0085Multilayer, e.g. LTCC, HTCC, green sheets inside PCB filters H05K H03H2001/0092Inductor filters, i.e. inductors whose parasitic capacitance is of relevance to consider it as filter H03H1/02of RC networks, e.g. integrated networks H03H2/00Networks using elements or techniques not provided for in groups H03H3/00 - H03H21/00 H03H2/001comprising magnetostatic wave network elements H03H2/003comprising optical fibre network elements optical elements per se G02B, G02F; transmission systems using light waves H04B10/00 H03H2/005Coupling circuits between transmission lines or antennas and transmitters, receivers or amplifiers H03H2/006Transmitter or amplifier output circuits H03H2/008Receiver or amplifier input circuits H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators H03H3/007for the manufacture of electromechanical resonators or networks H03H2003/0071of bulk acoustic wave and surface acoustic wave elements in the same process H03H3/0072of microelectro-mechanical resonators or networks micromembranes or microbeams B81B2203/01; manufacture of microstructural devices in general B81C H03H3/0073Integration with other electronic structures H03H3/0075Arrangements or methods specially adapted for testing microelecro-mechanical resonators or networks H03H3/0076for obtaining desired frequency or temperature coefficients H03H3/0077by tuning of resonance frequency H03H3/0078involving adjustment of the transducing gap H03H3/013for obtaining desired frequency or temperature coefficient H03H3/0076 H03H3/04, H03H3/10 take precedence H03H3/02for the manufacture of piezo-electric or electrostrictive resonators or networks H03H3/08 takes precedence H03H2003/021the resonators or networks being of the air-gap type H03H2003/022the resonators or networks being of the cantilever type H03H2003/023the resonators or networks being of the membrane type H03H2003/025the resonators or networks comprising an acoustic mirror H03H2003/026the resonators or networks being of the tuning fork type H03H2003/027the resonators or networks being of the microelectro-mechanical [MEMS] type H03H2003/028for obtaining desired values of other parameters H03H3/04for obtaining desired frequency or temperature coefficient H03H2003/0407Temperature coefficient H03H2003/0414Resonance frequency H03H2003/0421Modification of the thickness of an element H03H2003/0428of an electrode H03H2003/0435of a piezoelectric layer H03H2003/0442of a non-piezoelectric layer H03H2003/045Modification of the area of an element H03H2003/0457of an electrode H03H2003/0464operating on an additional circuit element, e.g. a passive circuit element connected to the resonator H03H2003/0471of a plurality of resonators at different frequencies H03H2003/0478in a process for mass production H03H2003/0485during the manufacture of a cantilever H03H2003/0492during the manufacture of a tuning-fork H03H3/06for the manufacture of magnetostrictive resonators or networks H03H3/08for the manufacture of resonators or networks using surface acoustic waves H03H3/10for obtaining desired frequency or temperature coefficient H03H5/00One-port networks comprising only passive electrical elements as network components H03H5/003comprising distributed impedance elements together with lumped impedance elements H03H5/006comprising simultaneously tunable inductance and capacitance H03H5/02without voltage- or current-dependent elements H03H5/10comprising at least one element with prescribed temperature coefficient H03H5/12with at least one voltage- or current-dependent element H03H7/00Multiple-port networks comprising only passive electrical elements as network components receiver input circuits H04B1/18; networks simulating a length of communication cable H04B3/40 H03H7/002Gyrators H03H7/004Capacitive coupling circuits not otherwise provided for H03H2007/006MEMS H03H2007/008the MEMS being trimmable H03H7/01Frequency selective two-port networks H03H7/0107Non-linear filters H03H7/0115comprising only inductors and capacitors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence H03H7/0123comprising distributed impedance elements together with lumped impedance elements H03H2007/013Notch or bandstop filters H03H7/0138Electrical filters or coupling circuits H03H7/0146Coupling circuits between two tubes, not otherwise provided for H03H7/0153Electrical filters; Controlling thereof H03H7/0161Bandpass filters H03H7/12 takes precedence H03H7/0169Intermediate frequency filters H03H7/0176witout magnetic core H03H7/0184with ferromagnetic core H03H2007/0192Complex filters H03H7/03comprising means for compensation of loss H03H7/06including resistors H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence H03H7/065Parallel T-filters H03H7/07Bridged T-filters H03H7/075Ladder networks, e.g. electric wave filters H03H7/09Filters comprising mutual inductance H03H7/12Bandpass or bandstop filters with adjustable bandwidth and fixed centre frequency H03H7/09 takes precedence; automatic control of bandwidth in amplifiers H03G5/16 H03H7/13using electro-optic elements H03H7/17Structural details of sub-circuits of frequency selective networks H03H7/1708Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path H03H7/07 takes precedence H03H7/1716Comprising foot-point elements H03H7/1725Element to ground being common to different shunt paths, i.e. Y-structure H03H7/1733Element between different shunt or branch paths H03H7/425 takes precedence H03H7/1741Comprising typical LC combinations, irrespective of presence and location of additional resistors when resistors are present, also classify in H03H7/06 - H03H7/07 H03H7/175Series LC in series path H03H7/1783 takes precedence H03H7/1758Series LC in shunt or branch path H03H7/1791 takes precedence H03H7/1766Parallel LC in series path H03H7/1783 takes precedence H03H7/1775Parallel LC in shunt or branch path H03H7/1791 takes precedence H03H7/1783Combined LC in series path H03H7/1791Combined LC in shunt or branch path H03H7/18Networks for phase shifting H03H7/185comprising distributed impedance elements together with lumped impedance elements H03H7/19Two-port phase shifters providing a predetermined phase shift, e.g. "all-pass" filters H03H7/20Two-port phase shifters providing an adjustable phase shift H03H7/21providing two or more phase shifted output signals, e.g. n-phase output H03H7/24Frequency- independent attenuators H03H7/25comprising an element controlled by an electric or magnetic variable H03H7/27 takes precedence H03H7/251the element being a thermistor H03H7/253the element being a diode H03H7/255the element being a PIN diode H03H7/256the element being a VARACTOR diode H03H7/258using a galvano-magnetic device H03H7/27comprising a photo-electric element H03H7/30Time-delay networks analogue shift registers G11C27/04 H03H7/32with lumped inductance and capacitance H03H7/325Adjustable networks H03H7/34with lumped and distributed reactance H03H7/345Adjustable networks H03H7/38Impedance-matching networks H03H7/383comprising distributed impedance elements together with lumped impedance elements H03H2007/386Multiple band impedance matching H03H7/40Automatic matching of load impedance to source impedance H03H7/42Balance/unbalance networks H03H7/422comprising distributed impedance elements together with lumped impedance elements H03H7/425Balance-balance networks H03H7/427Common-mode filters H02J3/01 and H02M1/126 takes precedence H03H7/46Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source for use in multiplex transmission systems H04J1/00 H03H7/461particularly adapted for use in common antenna systems H03H7/463Duplexers H03H7/465having variable circuit topology, e.g. including switches H03H7/466particularly adapted as input circuit for receivers H03H7/468particularly adapted as coupling circuit between transmitters and antennas H03H7/48Networks for connecting several sources or loads, working on the same frequency or frequency band, to a common load or source phase shifters providing two or more output signals H03H7/21 H03H7/482particularly adapted for use in common antenna systems H03H7/485particularly adapted as input circuit for receivers H03H7/487particularly adapted as coupling circuit between transmitters and antennas H03H7/52One-way transmission networks, i.e. unilines H03H7/54Modifications of networks to reduce influence of variations of temperature H03H9/00Networks comprising electromechanical or electro-acoustic devicesElectromechanical resonators making single crystals C30B; selection of materials thereof H01L; electromechanical transducers H04R; piezo-electric, electrostrictive or magnetostrictive devices per se H10N30/00 H03H9/0004Impedance-matching networks H03H9/145 takes precedence H03H9/0009using surface acoustic wave devices H03H9/0014using bulk acoustic wave devices H03H2009/0019Surface acoustic wave multichip H03H9/0023Balance-unbalance or balance-balance networks H03H9/0028using surface acoustic wave devices H03H9/0033having one acoustic track only H03H9/0038the balanced terminals being on the same side of the track H03H9/0042the balanced terminals being on opposite sides of the track H03H9/0047having two acoustic tracks H03H9/008, H03H9/0085 take precedence H03H9/0052being electrically cascaded H03H9/0057the balanced terminals being on the same side of the tracks H03H9/0061the balanced terminals being on opposite sides of the tracks H03H9/0066being electrically parallel H03H9/0071the balanced terminals being on the same side of the tracks H03H9/0076the balanced terminals being on opposite sides of the tracks H03H9/008having three acoustic tracks H03H9/0085 takes precedence H03H9/0085having four acoustic tracks H03H9/009Lattice filters H03H9/0095using bulk acoustic wave devices H03H9/02Details H03H9/02007of bulk acoustic wave devices H03H9/02015Characteristics of piezoelectric layers, e.g. cutting angles H03H9/02023consisting of quartz H03H9/02031consisting of ceramic H03H9/02039consisting of a material from the crystal group 32, e.g. langasite, langatate, langanite H03H9/02047Treatment of substrates H03H9/02055of the surface including the back surface H03H9/02062Details relating to the vibration mode H03H9/0207the vibration mode being harmonic H03H9/02078the vibration mode being overmoded H03H9/02086Means for compensation or elimination of undesirable effects H03H9/02094of adherence H03H9/02102of temperature influence cutting angles H03H9/02015 H03H9/0211of reflections H03H9/02118of lateral leakage between adjacent resonators H03H9/02125of parasitic elements H03H9/02133of stress H03H9/02141of electric discharge due to pyroelectricity H03H9/02149of ageing changes of characteristics, e.g. electro-acousto-migration H03H9/02157Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness H03H2009/02165Tuning H03H2009/02173of film bulk acoustic resonators [FBAR] H03H2009/02181by application of heat from a heat source H03H2009/02188Electrically tuning H03H2009/02196operating on the FBAR element, e.g. by direct application of a tuning DC voltage H03H2009/02204operating on an additional circuit element, e.g. applying a tuning DC voltage to a passive circuit element connected to the resonator H03H2009/02212Magnetically tuning H03H9/0222of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices H03H9/02228Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer H03H9/02236of surface skimming bulk wave devices H03H9/02244of microelectro-mechanical resonators H03H2009/02251Design H03H9/02259Driving or detection means H03H2009/02267having dimensions of atomic scale, e.g. involving electron transfer across vibration gap H03H9/02275Comb electrodes H03H2009/02283Vibrating means H03H2009/02291Beams H03H2009/02299Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length H03H2009/02307Dog-bone-like structure, i.e. the elongated part of the "bone" is doubly clamped H03H2009/02314forming part of a transistor structure H03H2009/02322Material H03H2009/0233comprising perforations H03H9/02338Suspension means H03H2009/02346Anchors for ring resonators H03H2009/02354applied along the periphery, e.g. at nodal points of the ring H03H9/02362Folded-flexure H03H2009/0237applied at the center H03H9/02377Symmetric folded-flexure H03H2009/02385Anchors for square resonators, i.e. resonators comprising a square vibrating membrane H03H9/02393Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor H03H9/02401by annealing H03H9/02409by application of a DC-bias voltage H03H9/02417 takes precedence H03H9/02417involving adjustment of the transducing gap H03H9/02425by electrostatically pulling the beam H03H9/02433Means for compensation or elimination of undesired effects H03H2009/0244Anchor loss H03H9/02448of temperature influence H03H2009/02456Parasitic elements or effects, e.g. parasitic capacitive coupling between input and output H03H2009/02464Pull-in H03H2009/02472Stiction H03H2009/0248Strain H03H2009/02488Vibration modes H03H2009/02496Horizontal, i.e. parallel to the substrate plane H03H2009/02503Breath-like, e.g. Lam? mode, wine-glass mode H03H2009/02511Vertical, i.e. perpendicular to the substrate plane H03H2009/02519Torsional H03H2009/02527Combined H03H9/02535of surface acoustic wave devices H03H9/02543Characteristics of substrate, e.g. cutting angles H03H9/02551of quartz substrates H03H9/02559of lithium niobate or lithium-tantalate substrates H03H9/02566of semiconductor substrates H03H9/02574of combined substrates, multilayered substrates, piezo-electrical layers on not-piezo- electrical substrate H03H9/02582of diamond substrates H03H9/0259of langasite substrates H03H9/02598of langatate substrates H03H9/02606of langanite substrates H03H9/02614Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves H03H9/02622of the surface, including back surface H03H9/02629of the edges H03H9/02637Details concerning reflective or coupling arrays H03H9/02645Waffle-iron or dot arrays H03H9/02653Grooves or arrays buried in the substrate H03H9/02661being located inside the interdigital transducers H03H9/02669Edge reflection structures, i.e. resonating structures without metallic reflectors, e.g. Bleustein-Gulyaev-Shimizu [BGS], shear horizontal [SH], shear transverse [ST], Love waves devices H03H9/02677having specially shaped edges, e.g. stepped, U-shaped edges H03H9/02685Grating lines having particular arrangements H03H9/02692Arched grating lines H03H9/027U-shaped grating lines H03H9/02708Shifted grating lines H03H9/02716Tilted, fan shaped or slanted grating lines H03H9/02724Comb like grating lines H03H9/02732Bilateral comb like grating lines H03H9/0274Intra-transducers grating lines H03H9/02748Dog-legged reflectors H03H9/02755Meandering floating or grounded grating lines H03H9/02763Left and right side electrically coupled reflectors H03H9/02771Reflector banks H03H9/02779Continuous surface reflective arrays H03H9/02787having wave guide like arrangements H03H9/02795Multi-strip couplers as track changers H03H9/02803Weighted reflective structures H03H9/02811Chirped reflective or coupling arrays H03H9/02818Means for compensation or elimination of undesirable effects H03H9/02826of adherence H03H9/02834of temperature influence cut angles H03H9/02543 H03H9/02842of reflections H03H9/6406 takes precedence H03H9/0285of triple transit echo H03H9/02858of wave front distortion H03H9/02866of bulk wave excitation and reflections H03H9/02874of direct coupling between input and output transducers H03H9/02881of diffraction of wave beam H03H9/02889of influence of mass loading H03H9/02897of strain or mechanical damage, e.g. strain due to bending influence H03H9/02905Measures for separating propagation paths on substrate H03H9/02913Measures for shielding against electromagnetic fields shielding of electrical components in general H05K9/00 H03H9/02921Measures for preventing electric discharge due to pyroelectricity H03H9/02929of ageing changes of characteristics, e.g. electro-acousto-migration H03H9/02937of chemical damage, e.g. corrosion H03H9/02944of ohmic loss H03H9/02952of parasitic capacitance H03H9/0296Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties H03H9/02968with optical devices mounting in enclosures H03H9/12 H03H9/02976with semiconductor devices H03H9/02984Protection measures against damaging H03H9/02992Details of bus bars, contact pads or other electrical connections for finger electrodes H03H9/05HoldersSupports H03H9/0504for bulk acoustic wave devices H03H9/0509consisting of adhesive elements H03H9/0514consisting of mounting pads or bumps H03H9/0519for cantilever H03H9/1021 takes precedence H03H9/0523for flip-chip mounting H03H9/0528consisting of clips H03H9/0533consisting of wire H03H9/0538Constructional combinations of supports or holders with electromechanical or other electronic elements H03H9/0542consisting of a lateral arrangement H03H9/0566 takes precedence H03H9/0547consisting of a vertical arrangement H03H9/0566 takes precedence H03H9/0552the device and the other elements being mounted on opposite sides of a common substrate H03H9/0557the other elements being buried in the substrate H03H9/0561consisting of a multilayered structure H03H9/0566for duplexers H03H9/0571including bulk acoustic wave [BAW] devices H03H9/0576including surface acoustic wave [SAW] devices H03H9/058for surface acoustic wave devices H03H9/0585consisting of an adhesive layer H03H9/059consisting of mounting pads or bumps H03H9/0595the holder support and resonator being formed in one body H03H9/08Holders with means for regulating temperature H03H9/09Elastic or damping supports H03H9/10Mounting in enclosures constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538 H03H9/1007for bulk acoustic wave [BAW] devices H03H9/1014the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device H03H9/1021the BAW device being of the cantilever type H03H9/1028the BAW device being held between spring terminals H03H9/1035the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device H03H9/1042the enclosure being defined by a housing formed by a cavity in a resin H03H9/105the enclosure being defined by a cover cap mounted on an element forming part of the BAW device H03H9/1057for microelectro-mechanical devices H03H9/1064for surface acoustic wave [SAW] devices H03H9/1071the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device H03H9/1078the enclosure being defined by a foil covering the non-active sides of the SAW device H03H9/1085the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device H03H9/1092the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's H03H9/12for networks with interaction of optical and acoustic waves H03H9/125Driving means, e.g. electrodes, coils H03H9/13for networks consisting of piezo-electric or electrostrictive materials H03H9/145 takes precedence H03H9/131consisting of a multilayered structure H03H9/132characterized by a particular shape H03H9/133for electromechanical delay lines or filters H03H9/135for networks consisting of magnetostrictive materials H03H9/145 takes precedence H03H9/145for networks using surface acoustic waves H03H9/14502Surface acoustic wave [SAW] transducers for a particular purpose H03H9/14505Unidirectional SAW transducers H03H9/14508Polyphase SAW transducers H03H9/14511SAW transducers for non-piezoelectric substrates H03H9/14514Broad band transducers H03H9/14517Means for weighting H03H9/1452by finger overlap length, apodisation H03H9/14523Capacitive tap weighted transducers H03H9/14526Finger withdrawal H03H9/14529Distributed tap H03H9/14532Series weighting; Transverse weighting H03H9/14535Position weighting H03H9/14538Formation H03H9/14541Multilayer finger or busbar electrode H03H9/14544Transducers of particular shape or position weighting H03H9/14517 H03H9/14547Fan shaped; Tilted; Shifted; Slanted; Tapered; Arched; Stepped finger transducers H03H9/1455constituted of N parallel or series transducers H03H9/14552comprising split fingers H03H9/14555Chirped transducers H03H9/6406 takes precedence H03H9/14558Slanted, tapered or fan shaped transducers H03H9/14561, H03H9/14564 take precedence H03H9/14561Arched, curved or ring shaped transducers H03H9/14564Shifted fingers transducers H03H9/14567Stepped-fan shaped transducers H03H9/1457Transducers having different finger widths H03H9/14573Arrow type transducers H03H9/14576Transducers whereby only the last fingers have different characteristics with respect to the other fingers, e.g. different shape, thickness or material, split finger H03H9/14579the last fingers having a different shape H03H9/14582the last fingers having a different pitch H03H9/14585the last fingers being split H03H9/14588Horizontally-split transducers H03H9/14591Vertically-split transducers H03H9/14594Plan-rotated or plan-tilted transducers H03H9/14597Matching SAW transducers to external electrical circuits H03H9/15Constructional features of resonators consisting of piezo-electric or electrostrictive material H03H9/25 takes precedence H03H2009/155using MEMS techniques H03H9/17having a single resonator crystal tuning forks H03H9/21 H03H9/171implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume H03H9/173Air-gaps H03H9/174Membranes H03H9/175Acoustic mirrors H03H9/176consisting of ceramic material H03H9/177, H03H9/178 take precedence H03H9/177of the energy-trap type H03H9/178of a laminated structure of multiple piezoelectric layers with inner electrodes H03H9/19consisting of quartz H03H9/205having multiple resonators crystal tuning forks H03H9/21 H03H9/21Crystal tuning forks H03H9/215consisting of quartz H03H9/22Constructional features of resonators consisting of magnetostrictive material H03H9/24Constructional features of resonators of material which is not piezo-electric, electrostrictive, or magnetostrictive H03H9/2405of microelectro-mechanical resonators H03H2009/241Bulk-mode MEMS resonators H03H2009/2415with concave shape [CBAR] H03H2009/2421with I shape [IBAR] H03H9/2426in combination with other electronic elements H03H9/2431Ring resonators H03H9/2436Disk resonators H03H2009/2442Square resonators H03H9/2447Beam resonators H03H9/2468 takes precedence H03H9/2452Free-free beam resonators H03H9/2457Clamped-free beam resonators H03H9/2463Clamped-clamped beam resonators H03H9/2468Tuning fork resonators H03H9/2473Double-Ended Tuning Fork [DETF] resonators H03H9/2478Single-Ended Tuning Fork resonators H03H9/2484with two fork tines, e.g. Y-beam cantilever H03H9/2489with more than two fork tines H03H9/2494H-shaped, i.e. two tuning forks with common base H03H9/25Constructional features of resonators using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36 H03H9/30Time-delay networks H03H9/36with non-adjustable delay time H03H9/40, H03H9/42 take precedence H03H9/38with adjustable delay time H03H9/40, H03H9/42 take precedence H03H9/40Frequency dependent delay lines, e.g. dispersive delay lines H03H9/42 takes precedence H03H9/42using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36 H03H9/423with adjustable delay time H03H9/426Magneto-elastic surface waves H03H9/44Frequency dependent delay lines, e.g. dispersive delay lines H03H9/46Filters multiple-port electromechanical filters H03H9/70 H03H9/462Microelectro-mechanical filters H03H9/465in combination with other electronic elements H03H9/467Post-fabrication trimming of parameters, e.g. center frequency H03H9/48Coupling means therefor H03H9/485for microelectro-mechanical filters H03H9/50Mechanical coupling means H03H9/505for microelectro-mechanical filters H03H9/52Electric coupling means H03H9/525for microelectro-mechanical filters H03H9/54comprising resonators of piezo-electric or electrostrictive material H03H9/64 takes precedence H03H9/542including passive elements H03H9/545 takes precedence H03H9/545including active elements H03H9/547Notch filters, e.g. notch BAW or thin film resonator filters H03H9/56Monolithic crystal filters H03H9/562comprising a ceramic piezoelectric layer H03H9/564implemented with thin-film techniques H03H9/566Electric coupling means therefor H03H9/0095 takes precedence H03H9/568consisting of a ladder configuration H03H9/58Multiple crystal filters H03H9/581comprising ceramic piezoelectric layers H03H9/582implemented with thin-film techniques H03H9/583comprising a plurality of piezoelectric layers acoustically coupled H03H9/584Coupled Resonator Filters [CFR] H03H9/585Stacked Crystal Filters [SCF] H03H9/586Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume H03H9/587Air-gaps H03H9/588Membranes H03H9/589Acoustic mirrors H03H9/60Electric coupling means therefor H03H9/0095 takes precedence H03H9/605consisting of a ladder configuration H03H9/62comprising resonators of magnetostrictive material H03H9/64 takes precedence H03H9/64using surface acoustic waves H03H9/6403Programmable filters H03H9/6406Filters characterised by a particular frequency characteristic H03H9/6409SAW notch filters H03H9/6413SAW comb filters H03H9/6416SAW matched filters, e.g. surface acoustic wave compressors, chirped or coded surface acoustic wave filters H03H9/642SAW transducers details for remote interrogation systems, e.g. surface acoustic wave transducers details for ID-tags remote interrogation systems per se G06K7/10009, G01S13/74 H03H9/6423Means for obtaining a particular transfer characteristic H03H9/6426Combinations of the characteristics of different transducers H03H9/643the transfer characteristic being determined by reflective or coupling array characteristics H03H9/6433Coupled resonator filters H03H9/6436having one acoustic track only H03H9/644having two acoustic tracks H03H9/6443being acoustically coupled H03H9/6446by floating multistrip couplers H03H9/645, H03H9/6453 take precedence H03H9/645by grating reflectors overlapping both tracks H03H9/6453by at least an interdigital transducer overlapping both tracks H03H9/6456being electrically coupled H03H9/6459via one connecting electrode H03H9/6463the tracks being electrically cascaded H03H9/6466each track containing more than two transducers H03H9/6469via two connecting electrodes H03H9/6473the electrodes being electrically interconnected H03H9/6476the tracks being electrically parallel H03H9/6479Capacitively coupled SAW resonator filters H03H9/6483Ladder SAW filters H03H9/6486having crossing or intersecting acoustic tracks, e.g. intersection in a perpendicular or diagonal orientation H03H9/6489Compensation of undesirable effects H03H9/6493Side lobe suppression H03H9/6496Reducing ripple in transfer characteristic H03H9/66Phase shifters H03H9/68using surface acoustic waves H03H9/70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source H03H9/703Networks using bulk acoustic wave devices H03H9/706Duplexers H03H9/72Networks using surface acoustic waves H03H9/725Duplexers H03H9/74Multiple-port networks for connecting several sources or loads, working on the same frequency or frequency band, to a common load or source networks for phase shifting H03H9/66 H03H9/76Networks using surface acoustic waves H03H11/00Networks using active elements H03H11/02Multiple-port networks H03H11/025using current conveyors H03H11/04Frequency selective two-port networks H03H11/0405Non-linear filters H03H2011/0411Rank order or median filters H03H11/0416using positive impedance converters H03H11/08 takes precedence H03H11/0422using transconductance amplifiers, e.g. gmC filters H03H11/0427Filters using a single transconductance amplifier; Filters derived from a single transconductor filter, e.g. by element substitution, cascading, parallel connection H03H11/0433 - H03H11/0472 take precedence H03H11/0433Two integrator loop filters H03H11/0455 takes precedence H03H11/0438Tow-Thomas biquad H03H11/0444Simulation of ladder networks H03H11/045Leapfrog structures H03H11/0455Multiple integrator loop feedback filters H03H11/0461Current mode filters H03H11/0466Filters combining transconductance amplifiers with other active elements, e.g. operational amplifiers, transistors, voltage conveyors H03H11/0472Current or voltage controlled filters H03H2011/0477using current feedback operational amplifiers H03H2011/0483using operational transresistance amplifiers [OTRA] H03H2011/0488Notch or bandstop filters H03H2011/0494Complex filters H03H11/06comprising means for compensation of loss H03H11/08using gyrators H03H11/10using negative impedance converters H03H11/08 takes precedence H03H11/11using current conveyors H03H11/12using amplifiers with feedback H03H11/0422 , H03H11/08, H03H11/10 take precedence H03H11/1204Distributed RC filters H03H11/1208comprising an electromechanical resonator H03H11/1213using transistor amplifiers H03H11/1204 takes precedence; parallel-T filters H03H11/1295 H03H11/1217using a plurality of operational amplifiers H03H11/1204 takes precedence; parallel-T filters H03H11/1295 H03H11/1221Theory; Synthesis H03H11/1226 - H03H11/1252 take precedence H03H11/1226Filters using operational amplifier poles H03H11/123Modifications to reduce sensitivity H03H11/1234Modifications to reduce detrimental influences of amplifier imperfections, e.g. limited gain-bandwith product, limited input impedance H03H11/1239Modifications to reduce influence of variations of temperature H03H11/1243Simulation of ladder networks H03H11/1247Leapfrog structures H03H11/1252Two integrator-loop-filters H03H11/1256Tow-Thomas biquad H03H11/126using a single operational amplifier H03H11/1204 takes precedence; parallel-T filters H03H11/1295 H03H11/1265Synthesis H03H11/1269 - H03H11/1282 take precedence H03H11/1269Filters using the operational amplifier pole H03H11/1273Modifications to reduce sensitivity H03H11/1278Modifications to reduce detrimental influences of amplifier imperfections, e.g. limited gain-bandwith product, limited input impedance H03H11/1282Modifications to reduce influence of variations of temperature H03H11/1286Sallen-Key biquad H03H11/1291Current or voltage controlled filters H03H11/1295Parallel-T filters H03H11/14using electro-optic devices H03H11/16Networks for phase shifting H03H11/18Two-port phase shifters providing a predetermined phase shift, e.g. "all-pass" filters H03H11/20Two-port phase shifters providing an adjustable phase shift H03H11/22providing two or more phase shifted output signals, e.g. n-phase output H03H11/24Frequency-independent attenuators H03H11/245using field-effect transistor H03H11/26Time-delay networks analogue shift registers G11C27/04 H03H11/265with adjustable delay H03H11/28Impedance matching networks H03H11/30Automatic matching of source impedance to load impedance H03H11/32Balance-unbalance networks H03H11/34Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source for use in multiplex transmission systems H04J1/00 H03H11/342particularly adapted for use in common antenna systems H03H11/344Duplexers H03H11/346particularly adapted as input circuit for receivers H03H11/348particularly adapted as coupling circuit between transmitters and antenna H03H11/36Networks for connecting several sources or loads, working on the same frequency band, to a common load or source phase shifters providing two or more output signals H03H11/22 H03H11/362particularly adapted for use in common antenna systems H03H11/365particularly adapted as input circuit for receivers H03H11/367particularly adapted as coupling circuit between transmitters and antenna H03H11/38One-way transmission networks, i.e. unilines H03H11/40Impedance converters H03H11/405Positive impedance converters H03H11/42 takes precedence; used in frequency selective networks H03H11/0416 H03H11/42Gyrators used in frequency selective networks H03H11/08 H03H11/44Negative impedance converters H03H11/42 takes precedence; used in frequency selective networks H03H11/10 H03H11/46One-port networks H03H11/48simulating reactances H03H11/481Simulating capacitances H03H11/483Simulating capacitance multipliers H03H11/485Simulating inductances using operational amplifiers H03H11/486Simulating inductances using transconductance amplifiers H03H11/488Simulating inductances using current conveyors H03H11/50using gyrators H03H11/52simulating negative resistances H03H11/525Simulating frequency dependent negative resistance [FDNR] H03H11/53simulating resistances; simulating resistance multipliers H03H11/54Modifications of networks to reduce influence of variations of temperature H03H15/00Transversal filters electromechanical filters H03H9/46, H03H9/70 H03H2015/002Computation saving measures H03H2015/005comprising capacitors implemented with MEMS technology H03H2015/007Programmable filters H03H15/02using analogue shift registers H03H15/023with parallel-input configuration H03H2015/026Matched filters in charge domain H03H17/00Networks using digital techniques H03H17/0009Time-delay networks H03H17/0018Realizing a fractional delay H03H17/0027by means of a non-recursive filter H03H17/0036by means of a recursive filter H03H17/0045Impedance matching networks H03H17/0054Attenuators H03H17/0063R, L, C, simulating networks H03H2017/0072Theoretical filter design H03H2017/0081of FIR filters H03H2017/009of IIR filters H03H17/02Frequency selective networks digital computers for complex mathematical operations G06F17/10 H03H17/0201Wave digital filters H03H17/0202Two or more dimensional filters; Filters for complex signals multidimensional convolutions G06F17/153 H03H2017/0204Comb filters H03H2017/0205Kalman filters H03H2017/0207Median filters H03H2017/0208using neural networks H03H2017/021Wave digital filters H03H17/0211using specific transformation algorithms, e.g. WALSH functions, Fermat transforms, Mersenne transforms, polynomial transforms, Hilbert transforms correlation computation G06F17/156 H03H17/0213Frequency domain filters using Fourier transforms H03H2017/0214with input-sampling frequency and output-delivery frequency which differ, e.g. interpolation, extrapolation; anti-aliasing H03H17/0216Quefrency domain filters H03H17/0217Number theoretic transforms H03H17/0219Compensation of undesirable effects, e.g. quantisation noise, overflow stability problems H03H17/0461 H03H2017/022Rounding error H03H2017/0222Phase error H03H17/0223Computation saving measures; Accelerating measures computations per se G06F H03H17/0225Measures concerning the multipliers H03H17/0226comprising look-up tables H03H17/0227Measures concerning the coefficients H03H17/0229reducing the number of taps H03H17/023reducing the wordlength, the possible values of coefficients H03H2017/0232Canonical signed digit [CSD] or power of 2 coefficients H03H17/0233Measures concerning the signal representation H03H17/0235reducing the wordlength of signals H03H17/0236using codes H03H17/0238Measures concerning the arithmetic used performing computations G06F7/60 H03H17/0239Signed digit arithmetic H03H17/0241Distributed arithmetic H03H17/0242Residue number arithmetic H03H2017/0244Measures to reduce settling time H03H2017/0245Measures to reduce power consumption H03H17/0223 takes precedence H03H2017/0247Parallel structures using a slower clock H03H17/0248Filters characterised by a particular frequency response or filtering method H03H17/025Notch filters H03H17/0251Comb filters H03H17/0252Elliptic filters H03H17/0254Matched filters H03H17/0255Filters based on statistics adaptive filters H03H21/0029 H03H17/0257KALMAN filters H03H17/0258ARMA filters H03H17/026Averaging filters H03H17/0261Non linear filters H03H17/0263Rank order filters H03H17/0264Filter sets with mutual related characteristics H03H17/0266Filter banks H03H17/0267comprising non-recursive filters H03H17/0269comprising recursive filters H03H17/027Complementary filters; Phase complementary filters H03H17/0272Quadrature mirror filters H03H17/0273Polyphase filters H03H17/0275comprising non-recursive filters H03H17/0276having two phases H03H17/0277comprising recursive filters H03H17/0279having two phases H03H17/028Polynomial filters H03H17/0282Sinc or gaussian filters H03H17/0671 takes precedence H03H17/0283Filters characterised by the filter structure H03H17/0202, H03H17/0219 - H03H17/0248 take precedence H03H17/0285Ladder or lattice filters H03H17/0286Combinations of filter structures H03H17/0288Recursive, non-recursive, ladder, lattice structures H03H17/0289Digital and active filter structures H03H17/0291Digital and sampled data filters H03H17/0292Time multiplexed filters; Time sharing filters H03H17/0294Variable filters; Programmable filters H03H2017/0295Changing between two filter characteristics H03H2017/0297Coefficients derived from input parameters H03H2017/0298DSP implementation H03H17/04Recursive filters H03H17/0405comprising a ROM addressed by the input and output data signals H03H17/0411using DELTA modulation H03H17/0416with input-sampling frequency and output-delivery frequency which differ, e.g. extrapolation; Anti-aliasing H03H17/0422the input and output signals being derived from two separate clocks, i.e. asynchronous sample rate conversion H03H17/0427characterized by the ratio between the input-sampling and output-delivery frequencies H03H17/0433the ratio being arbitrary or irrational H03H17/0438the ratio being integer H03H17/0444where the output-delivery frequency is higher than the input sampling frequency, i.e. interpolation H03H17/045where the output-delivery frequency is lower than the input sampling frequency, i.e. decimation H03H17/0455the ratio being rational H03H17/0461Quantisation; Rounding; Truncation; Overflow oscillations or limit cycles eliminating measures H03H2017/0466Reduction of limit cycle oscillation H03H2017/0472based on allpass structures H03H2017/0477Direct form I H03H2017/0483Transposed H03H2017/0488Direct form II H03H2017/0494Transposed H03H17/06Non-recursive filters H03H17/0607comprising a ROM addressed by the input data signals H03H17/0614using Delta-modulation H03H17/0621with input-sampling frequency and output-delivery frequency which differ, e.g. extrapolation; Anti-aliasing H03H17/0628the input and output signals being derived from two separate clocks, i.e. asynchronous sample rate conversion H03H17/0635characterized by the ratio between the input-sampling and output-delivery frequencies H03H17/0642the ratio being arbitrary or irrational H03H17/065the ratio being integer H03H17/0657where the output-delivery frequency is higher than the input sampling frequency, i.e. interpolation H03H17/0664where the output-delivery frequency is lower than the input sampling frequency, i.e. decimation H03H17/0671Cascaded integrator-comb [CIC] filters H03H2017/0678with parallel structure, i.e. parallel CIC [PCIC] H03H17/0685the ratio being rational H03H2017/0692Transposed H03H17/08Networks for phase shifting H03H19/00Networks using time-varying elements, e.g. N-path filters H03H19/002N-path filters H03H19/004Switched capacitor networks H03H19/006simulating one-port networks H03H19/008with variable switch closing time H03H21/00Adaptive networks H03H21/0001Analogue adaptive filters H03H21/0003comprising CCD devices H03H21/0005comprising SAW devices H03H21/0007comprising switched capacitor [SC] devices H03H2021/0009Details H03H2021/001Analog multipliers H03H21/0012Digital adaptive filters H03H21/0014Lattice filters H03H21/0016Non linear filters H03H21/0018Matched filters H03H21/002Filters with a particular frequency response H03H21/0014 - H03H21/0018 take precedence H03H21/0021Notch filters H03H21/0023Comb filters H03H21/0025Particular filtering methods H03H21/0027filtering in the frequency domain H03H21/0029based on statistics H03H21/003KALMAN filters H03H21/0032ARMA filters H03H2021/0034Blind source separation H03H2021/0036of convolutive mixtures H03H2021/0038of instantaneous mixtures H03H2021/004using state space representation H03H2021/0041Subband decomposition H03H21/0043Adaptive algorithms H03H2021/0045Equation error H03H2021/0047Combined output and equation error H03H2021/0049Recursive least squares algorithm H03H2021/005with forgetting factor H03H2021/0052combined with stochastic gradient algorithm H03H2021/0054Affine projection H03H2021/0056Non-recursive least squares algorithm [LMS] H03H2021/0058Block LMS, i.e. in frequency domain H03H2021/0059Delayed LMS H03H2021/0061Normalized LMS [NLMS] H03H2021/0063Proportionate NLMS H03H2021/0065Sign-sign LMS H03H21/0067Means or methods for compensation of undesirable effects H03H2021/0069Finite wordlength H03H2021/007Computation saving measures; Accelerating measures H03H2021/0072Measures relating to the coefficients H03H2021/0074Reduction of the update frequency H03H2021/0076Measures relating to the convergence time H03H2021/0072 takes precedence H03H2021/0078varying the step size H03H2021/0079using look-up tables H03H2021/0081Details H03H2021/0083Shadow filter, i.e. one of two filters which are simultaneously adapted, wherein the results of adapting the shadow filter are used for adapting the other filter H03H2021/0085Applications H03H2021/0087Prediction H03H2021/0089System identification, i.e. modeling H03H2021/009with recursive filters H03H2021/0092Equalization, i.e. inverse modeling H03H2021/0094Interference Cancelling H03H2021/0096with input-sampling frequency and output-delivery frequency which differ, e.g. extrapolation; anti-aliasing H03H2021/0098Adaptive filters comprising analog and digital structures H03H2210/00 H03H2210/00Indexing scheme relating to details of tunable filters H03H2210/01Tuned parameter of filter characteristics H03H2210/012Centre frequencyCut-off frequency H03H2210/015Quality factor or bandwidth H03H2210/017Amplitude, gain or attenuation H03H2210/02Variable filter component H03H2210/021Amplifier, e.g. transconductance amplifier H03H2210/023Tuning of transconductance via tail current source H03H2210/025Capacitor H03H2210/026Inductor H03H2210/028Resistor H03H2210/03Type of tuning H03H2210/033Continuous H03H2210/036Stepwise H03H2210/04Filter calibration method H03H2210/043by measuring time constant H03H2210/046Master -slave H03H2218/00Indexing scheme relating to details of digital filters H03H2218/02Coefficients H03H2218/025updated selectively, e.g. by, in the presence of noise, temporally cancelling the update and outputting a predetermined value H03H2218/04In-phase and quadrature [I/Q] signals H03H2218/06Multiple-input, multiple-output [MIMO]Multiple-input, single-output [MISO] H03H2218/08Resource sharing H03H2218/085Multipliers H03H2218/10Multiplier and or accumulator units H03H2218/12Signal conditioning H03H2218/14Non-uniform sampling H03H2220/00Indexing scheme relating to structures of digital filters H03H2220/02Modular, e.g. cells connected in cascade H03H2220/04Pipelined H03H2220/06Systolic H03H2220/08Variable filter length H03H2222/00Indexing scheme relating to digital filtering methods H03H2222/02using fuzzy logic H03H2222/04using neural networks H03H2222/06using wavelets H03H2240/00Indexing scheme relating to filter banks H03H2250/00Indexing scheme relating to dual- or multi-band filters H03H2260/00Theory relating to impedance networks