B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES piezo-electric, electrostrictive or magnetostrictive elements per se H10N30/00This subclass does not cover: purely electrical or electronic devices per se which are covered by section H, e.g. subclass H01L or class H10;purely optical devices per se which are covered by subclasses G02B or G02F;essentially two-dimensional structures, e.g. layered products which are covered by subclass B32B;chemical or biological structures per se which are covered by section C;structures in atomic scale produced by manipulation of single atoms or molecules, which are covered by group B82B1/00.Devices or systems classified in this subclass are also classified in appropriate subclasses providing for their structural or functional features, if such features are of interest.Attention is drawn to the following places: A61K9/50 Microcapsules for medicinal preparations B25J7/00Micromanipulators G02B21/32Micromanupulators combined with microscopes G11B5/127Magnetic heads H01P3/08Waveguide microstrips. In this subclass, local "residual" subgroups, e.g. B81B7/0077, are used with the following purpose: When classifying a document which does not fit in any of a set of subgroups with the same dot-level, the document should be classified in the residual group, if present, and not in the group at the hierarchical level one dot above.
In the example, the document shall be classified in B81B7/0077 and not in B81B7/0032 as B81B7/0077 is "residual" to B81B7/0035-B81B7/0074In this subclass non-limiting references (in the sense of paragraph 39 of the Guide to the IPC) may still be displayed in the scheme. B81B1/00 B81B1/00Devices without movable or flexible elements, e.g. microcapillary devices B81B1/002Holes characterised by their shape, in either longitudinal or sectional plane B81B1/004Through-holes, i.e. extending from one face to the other face of the wafer B81B1/006Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters B81B1/008Microtips B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes B81B5/00 takes precedence B81B3/0002Arrangements for avoiding sticking of the flexible or moving parts B81B3/0005Anti-stiction coatings B81B3/0008Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation B81B3/001Structures having a reduced contact area, e.g. with bumps or with a textured surface B81B3/0013Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness B81B3/0016Arrangements for avoiding sticking of the flexible or moving parts not provided for in groups B81B3/0005 - B81B3/0013 B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators B81B3/0021Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezo-electric devices H10N30/00 B81B3/0024Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators electric motors using thermal effects H02N10/00 B81B3/0027Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation B81B3/0029Transducers for transforming light into mechanical energy or viceversa B81B3/0032Structures for transforming energy not provided for in groups B81B3/0021 - B81B3/0029 B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements B81B3/0037For increasing stroke, i.e. achieve large displacement of actuated parts B81B3/004Angular deflection B81B3/0043Increasing angular deflection B81B3/0045Improve properties related to angular swinging, e.g. control resonance frequency B81B3/0048Constitution or structural means for controlling angular deflection not provided for in groups B81B3/0043 - B81B3/0045 B81B3/0051For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60 B81B3/0054For holding or placing an element in a given position B81B3/0056Adjusting the distance between two elements, at least one of them being movable, e.g. air-gap tuning B81B3/0059Constitution or structural means for controlling the movement not provided for in groups B81B3/0037 - B81B3/0056 B81B3/0062Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device B81B3/0067Mechanical properties B81B3/007For controlling stiffness, e.g. ribs B81B3/0072For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers B81B3/0075For improving wear resistance B81B3/0078Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075 B81B3/0081Thermal properties B81B3/0083Optical properties B81B3/0086Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage B81B3/0089Chemical or biological characteristics, e.g. layer which makes a surface chemically active B81B3/0091Magnetic properties, e.g. guiding magnetic flux B81B3/0094Constitution or structural means for improving or controlling physical properties not provided for in B81B3/0067 - B81B3/0091 B81B3/0097Devices comprising flexible or deformable elements not provided for in groups B81B3/0002 - B81B3/0094 B81B5/00Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems B81B7/0003MEMS mechanisms for assembling automatically hinged components, self-assembly devices self-assembly processes B81C1/00007 B81B7/0006Interconnects B81B7/0009Structural features, others than packages, for protecting a device against environmental influences B81C1/00777 takes precedence B81B7/0012Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment B81B7/0016Protection against shocks or vibrations, e.g. vibration damping B81B7/0019Protection against thermal alteration or destruction B81B7/0083 takes precedence B81B7/0022Protection against electrostatic discharge electrostatic discharge protection for electronic semiconductor circuits H01L27/0248; circuit arrangements for protecting electronic switching circuits used for pulse technique against overcurrent or overvoltage H03K17/08 B81B7/0025Protection against chemical alteration B81B7/0029Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025 B81B7/0032Packages or encapsulation processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023 B81B7/0035for maintaining a controlled atmosphere inside of the chamber containing the MEMS B81B7/0038using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters B81B7/0041maintaining a controlled atmosphere with techniques not provided for in B81B7/0038 B81B7/0045for reducing stress inside of the package structure B81B7/0048between the MEMS die and the substrate B81B7/0051between the package lid and the substrate B81B7/0054between other parts not provided for in B81B7/0048 - B81B7/0051 B81B7/0058for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations B81B7/0061suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound B81B7/0064for protecting against electromagnetic or electrostatic interferences B81B7/0067for controlling the passage of optical signals through the package B81B7/007Interconnections between the MEMS and external electrical signals B81B7/00743D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board B81B7/0077Other packages not provided for in groups B81B7/0035 - B81B7/0074 B81B7/008MEMS characterised by an electronic circuit specially adapted for controlling or driving the same B81B7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G3/00 This group covers: only MEMS with an electronic circuit which is not specific to a particular application. This group does not cover: electronic circuits per se, e.g. for controlling or driving application specific MEMS B81B7/0083Temperature control B81B7/0087On-device systems and sensors for controlling, regulating or monitoring B81B7/009Maintaining a constant temperature by heating or cooling B81B7/0093by cooling B81B7/0096by heating B81B7/02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence B81B7/04Networks or arrays of similar microstructural devices B81B2201/00 B81B2201/00Specific applications of microelectromechanical systems B81B2201/01Switches B81B2201/012characterised by the shape B81B2201/014having a cantilever fixed on one side connected to one or more dimples B81B2201/016having a bridge fixed on two ends and connected to one or more dimples B81B2201/018Switches not provided for in B81B2201/014 - B81B2201/016 B81B2201/02Sensors B81B2201/0207Bolometers B81B2201/0214BiosensorsChemical sensors B81B2201/0221Variable capacitors B81B2201/0228Inertial sensors B81B2201/0235Accelerometers B81B2201/0242Gyroscopes B81B2201/025Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 B81B2201/0257Microphones or microspeakers B81B2201/0264Pressure sensors B81B2201/0271Resonatorsultrasonic resonators B81B2201/0278Temperature sensors B81B2201/0285Vibration sensors B81B2201/0292Sensors not provided for in B81B2201/0207 - B81B2201/0285 B81B2201/03Microengines and actuators B81B2201/031Thermal actuators B81B2201/032Bimorph and unimorph actuators, e.g. piezo and thermo B81B2201/033Comb drives B81B2201/034Electrical rotating micromachines B81B2201/035Microgears B81B2201/036Micropumps B81B2201/037Microtransmissions B81B2201/038Microengines and actuators not provided for in B81B2201/031 - B81B2201/037 B81B2201/04Optical MEMS B81B2201/042Micromirrors, not used as optical switches B81B2201/045Optical switches B81B2201/047Optical MEMS not provided for in B81B2201/042 - B81B2201/045 B81B2201/05Microfluidics B81B2201/051Micromixers, microreactors B81B2201/052Ink-jet print cartridges B81B2201/054Microvalves B81B2201/055Microneedles B81B2201/057Micropipets, dropformers B81B2201/058Microfluidics not provided for in B81B2201/051 - B81B2201/054 B81B2201/06Bio-MEMS B81B2201/07Data storage devices, static or dynamic memories B81B2201/10Microfilters, e.g. for gas or fluids B81B2201/11Read heads, write heads or micropositioners for hard- or optical disks B81B2201/12STM or AFM microtips B81B2201/13Mechanical connectors, i.e. not functioning as an electrical connector B81B2203/00Basic microelectromechanical structures B81B2203/01Suspended structures, i.e. structures allowing a movement B81B2203/0109Bridges B81B2203/0118Cantilevers B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to anotherMembranes, i.e. diaphragms with filtering function B81B2203/0136Comb structures B81B2203/0145Flexible holders B81B2203/0154Torsion bars B81B2203/0163Spring holders B81B2203/0172Flexible holders not provided for in B81B2203/0154 - B81B2203/0163 B81B2203/0181See-saws B81B2203/019characterized by their profile B81B2203/03Static structures B81B2203/0307Anchors B81B2203/0315Cavities B81B2203/0323Grooves B81B2203/033Trenches B81B2203/0338Channels B81B2203/0346Grooves not provided for in B81B2203/033 - B81B2203/0338 B81B2203/0353Holes B81B2203/0361Tips, pillars B81B2203/0369characterized by their profile B81B2203/0376rounded profile B81B2203/0384sloped profile B81B2203/0392profiles not provided for in B81B2203/0376 - B81B2203/0384 B81B2203/04Electrodes B81B2203/05Type of movement B81B2203/051Translation according to an axis parallel to the substrate B81B2203/053Translation according to an axis perpendicular to the substrate B81B2203/055Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane B81B2203/056Rotation in a plane parallel to the substrate B81B2203/058Rotation out of a plane parallel to the substrate B81B2203/06Devices comprising elements which are movable in relation to each other, e.g. slidable or rotatable B81B2207/00Microstructural systems or auxiliary parts thereof B81B2207/01comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS B81B2207/012the micromechanical device and the control or processing electronics being separate parts in the same package B81B2207/015the micromechanical device and the control or processing electronics being integrated on the same substrate B81B2207/017Smart-MEMS not provided for in B81B2207/012 - B81B2207/015 B81B2207/03Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting B81B2207/05Arrays B81B2207/053of movable structures B81B2207/056of static structures B81B2207/07Interconnects B81B2207/09Packages B81B2207/091Arrangements for connecting external electrical signals to mechanical structures inside the package B81B2207/092Buried interconnects in the substrate or in the lid B81B2207/093Conductive package seal B81B2207/094Feed-through, via B81B2207/095through the lid B81B2207/096through the substrate B81B2207/097Interconnects arranged on the substrate or the lid, and covered by the package seal B81B2207/098Arrangements not provided for in groups B81B2207/092 - B81B2207/097 B81B2207/11Structural features, others than packages, for protecting a device against environmental influences B81B2207/115Protective layers applied directly to the device before packaging B81B2207/99Microstructural systems or auxiliary parts thereof not provided for in B81B2207/01 - B81B2207/115