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277 lines
151 KiB
XML
<?xml version="1.0" encoding="UTF-8"?>
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<class-scheme publication-date="2023-02-01" scheme-type="cpc" publication-type="official">
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<classification-item breakdown-code="false" not-allocatable="true" level="5" additional-only="false" sort-key="B81C" definition-exists="true" date-revised="2023-02-01" status="published"><classification-symbol>B81C</classification-symbol><class-title date-revised="2023-02-01"><title-part><text>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS </text><reference><text>making microcapsules or microballoons <class-ref scheme="cpc">B01J13/02</class-ref>; processes or apparatus peculiar to the manufacture or treatment of piezo-electric, electrostrictive or magnetostrictive element <u>per se</u> <class-ref scheme="cpc">H10N30/01</class-ref></text></reference></title-part></class-title><notes-and-warnings date-revised="2013-01-01"><note type="note"><note-paragraph>This subclass <u>does not cover</u>:<subnote type="bullet"><note-paragraph>processes or apparatus for the manufacture or treatment of purely electrical or electronic devices, which are covered by section <class-ref scheme="cpc">H</class-ref>, e.g. group <class-ref scheme="cpc">H01L21/00</class-ref>;</note-paragraph><note-paragraph>processes or apparatus involving the manipulation of single atoms or molecules, which are covered by group <class-ref scheme="cpc">B82B3/00</class-ref>.</note-paragraph></subnote></note-paragraph><note-paragraph>In this subclass, local "residual" subgroups, e.g. <class-ref scheme="cpc">B81C1/00126</class-ref>, are used with the following purpose.<br/>When classifying a document which does not fit in any of a set of subgroups with the same dot-level, the document should be classified in the residual group, if present, and not in the group at the hierarchical level one dot above.<br/>In the example, the document shall be classified in <class-ref scheme="cpc">B81C1/00126</class-ref> and not in <class-ref scheme="cpc">B81C1/00023</class-ref> as <class-ref scheme="cpc">B81C1/00126</class-ref> is "residual" to <class-ref scheme="cpc">B81C1/00031</class-ref>-<class-ref scheme="cpc">B81C1/00119</class-ref></note-paragraph></note></notes-and-warnings>
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<classification-item breakdown-code="false" not-allocatable="true" level="6" additional-only="false" sort-key="B81C1/00" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00</classification-symbol>
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<classification-item breakdown-code="false" not-allocatable="false" level="7" additional-only="false" sort-key="B81C1/00" definition-exists="true" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Manufacture or treatment of devices or systems in or on a substrate </text><reference><text><class-ref scheme="cpc">B81C3/00</class-ref> takes precedence</text></reference></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00007" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00007</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Assembling automatically hinged components, i.e. self-assembly processes </text><reference><text>self-assembly mechanisms <class-ref scheme="cpc">B81B7/0003</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00015" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/00015</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>for manufacturing microsystems</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00023" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2022-01-01" status="published"><classification-symbol>B81C1/00023</classification-symbol><class-title date-revised="2022-01-01"><title-part><CPC-specific-text><text>without movable or flexible elements </text><reference><text>array of static structures for functionalising surfaces in <class-ref scheme="cpc">B81C1/00206</class-ref>; manufacture of MEMS devices for specific applications, <u>see</u> relevant places, e.g. microreactors <class-ref scheme="cpc">B01J19/0093</class-ref>, lab-on-chip <class-ref scheme="cpc">B01L3/5027</class-ref>, micromixers <class-ref scheme="cpc">B01F33/30</class-ref></text></reference></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00031" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00031</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Regular or irregular arrays of nanoscale structures, e.g. etch mask layer </text><reference><text>photomechanical, e.g. photolithographic, production of textured or patterned surfaces <class-ref scheme="cpc">G03F7/00</class-ref>; lithographic processes for making patterned surfaces using printing and stamping <class-ref scheme="cpc">G03F7/0002</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00039" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00039</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Anchors</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00047" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00047</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Cavities</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00055" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00055</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Grooves</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00063" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00063</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Trenches</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00071" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00071</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Channels</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00079" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00079</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Grooves not provided for in groups <class-ref scheme="cpc">B81C1/00063</class-ref> - <class-ref scheme="cpc">B81C1/00071</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00087" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00087</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Holes</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00095" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00095</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Interconnects</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00103" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00103</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Structures having a predefined profile, e.g. sloped or rounded grooves</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00111" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00111</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Tips, pillars, i.e. raised structures </text><reference><text>microneedles <class-ref scheme="cpc">A61M37/0015</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00119" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00119</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00126" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00126</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Static structures not provided for in groups <class-ref scheme="cpc">B81C1/00031</class-ref> - <class-ref scheme="cpc">B81C1/00119</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00134" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00134</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>comprising flexible or deformable structures </text><reference><text>manufacture of MEMS devices for specific applications, <u>see</u> relevant places, e.g. gyroscopes <class-ref scheme="cpc">G01C19/5719</class-ref>, pressure sensors <class-ref scheme="cpc">G01L9/0042</class-ref>, accelerometers <class-ref scheme="cpc">G01P15/0802</class-ref>, acoustic transducers or diaphragms therefor <class-ref scheme="cpc">H04R31/00</class-ref></text></reference></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00142" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/00142</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Bridges </text><reference><text>deformable micromirrors <class-ref scheme="cpc">G02B26/0841</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/0015" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/0015</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Cantilevers </text><reference><text>switches using MEMS <class-ref scheme="cpc">H01H1/0036</class-ref>; electrostatic relays using micromechanics <class-ref scheme="cpc">H01H59/0009</class-ref>; microelectro-mechanical resonators <class-ref scheme="cpc">H03H9/02244</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00158" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00158</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Diaphragms, membranes </text><reference><text>manufacture process for semi-permeable inorganic membranes <class-ref scheme="cpc">B01D67/0039</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00166" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00166</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Electrodes</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00174" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00174</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>See-saws</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00182" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00182</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/0019" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/0019</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Flexible or deformable structures not provided for in groups <class-ref scheme="cpc">B81C1/00142</class-ref> - <class-ref scheme="cpc">B81C1/00182</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00198" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00198</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00206" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00206</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00214" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/00214</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00222" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00222</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Integrating an electronic processing unit with a micromechanical structure</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/0023" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0023</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Packaging together an electronic processing unit die and a micromechanical structure die </text><reference><text>MEMS packages <class-ref scheme="cpc">B81B7/0032</class-ref>; MEMS packaging processes <class-ref scheme="cpc">B81C1/00261</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00238" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00238</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00246" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00246</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00253" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00253</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Processes for integrating an electronic processing unit with a micromechanical structure not provided for in <class-ref scheme="cpc">B81C1/0023</class-ref> - <class-ref scheme="cpc">B81C1/00246</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00261" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00261</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Processes for packaging MEMS devices </text><reference><text>MEMS packages <class-ref scheme="cpc">B81B7/0032</class-ref>, packaging of smart-MEMS <class-ref scheme="cpc">B81C1/0023</class-ref></text></reference></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00269" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00269</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Bonding of solid lids or wafers to the substrate</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00277" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00277</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>for maintaining a controlled atmosphere inside of the cavity containing the MEMS</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00285" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00285</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00293" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00293</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>maintaining a controlled atmosphere with processes not provided for in <class-ref scheme="cpc">B81C1/00285</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00301" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00301</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00309" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-08-01" status="published"><classification-symbol>B81C1/00309</classification-symbol><class-title date-revised="2016-08-01"><title-part><CPC-specific-text><text>suitable for fluid transfer from the MEMS out of the package or <u>vice versa</u>, e.g. transfer of liquid, gas, sound</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00317" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00317</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Packaging optical devices</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00325" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00325</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>for reducing stress inside of the package structure</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00333" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00333</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Aspects relating to packaging of MEMS devices, not covered by groups <class-ref scheme="cpc">B81C1/00269</class-ref> - <class-ref scheme="cpc">B81C1/00325</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00341" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/00341</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Processes for manufacturing microsystems not provided for in groups <class-ref scheme="cpc">B81C1/00023</class-ref> - <class-ref scheme="cpc">B81C1/00261</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00349" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00349</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Creating layers of material on a substrate</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00357" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00357</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>involving bonding one or several substrates on a non-temporary support, e.g. another substrate</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00365" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00365</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>having low tensile stress between layers</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00373" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/00373</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Selective deposition, e.g. printing or microcontact printing</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0038" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/0038</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Processes for creating layers of materials not provided for in groups <class-ref scheme="cpc">B81C1/00357</class-ref> - <class-ref scheme="cpc">B81C1/00373</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00388" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00388</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Etch mask forming</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00396" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00396</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Mask characterised by its composition, e.g. multilayer masks</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00404" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00404</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Mask characterised by its size, orientation or shape</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00412" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00412</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Mask characterised by its behaviour during the etching process, e.g. soluble masks</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0042" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0042</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Compensation masks in orientation dependent etching</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00428" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00428</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Etch mask forming processes not provided for in groups <class-ref scheme="cpc">B81C1/00396</class-ref> - <class-ref scheme="cpc">B81C1/0042</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00436" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00436</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00444" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00444</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Surface micromachining, i.e. structuring layers on the substrate</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/0046" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C1/0046</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>using stamping, e.g. imprinting </text><reference><text>nanoimprinting for making etch masks <class-ref scheme="cpc">G03F7/0002</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00468" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00468</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Releasing structures</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00476" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00476</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>removing a sacrificial layer </text><reference><text><class-ref scheme="cpc">B81C1/00912</class-ref> takes precedence</text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00484" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00484</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Processes for releasing structures not provided for in group <class-ref scheme="cpc">B81C1/00476</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00492" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00492</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Processes for surface micromachining not provided for in groups <class-ref scheme="cpc">B81C1/0046</class-ref> - <class-ref scheme="cpc">B81C1/00484</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/005" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/005</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Bulk micromachining</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00507" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00507</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Formation of buried layers by techniques other than deposition, e.g. by deep implantation of elements </text><reference><text>SIMOX techniques <class-ref scheme="cpc">H01L21/762</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00515" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00515</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Bulk micromachining techniques not provided for in <class-ref scheme="cpc">B81C1/00507</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00523" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00523</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Etching material</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00531" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00531</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Dry etching</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00539" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00539</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Wet etching</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00547" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00547</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Etching processes not provided for in groups <class-ref scheme="cpc">B81C1/00531</class-ref> - <class-ref scheme="cpc">B81C1/00539</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00555" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00555</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity </text><reference><text><class-ref scheme="cpc">B81C1/00023</class-ref> - <class-ref scheme="cpc">B81C1/0019</class-ref> take precedence</text></reference></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00563" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00563</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Avoid or control over-etching</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00571" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00571</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Avoid or control under-cutting</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00579" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00579</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Avoid charge built-up</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="11" additional-only="false" sort-key="B81C1/00587" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00587</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Processes for avoiding or controlling over-etching not provided for in <class-ref scheme="cpc">B81C1/00571</class-ref> - <class-ref scheme="cpc">B81C1/00579</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00595" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00595</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Control etch selectivity</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00603" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00603</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Aligning features and geometries on both sides of a substrate, e.g. when double side etching</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00611" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00611</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Processes for the planarisation of structures </text><reference><text>planarising depositions <class-ref scheme="cpc">C23C</class-ref>, <class-ref scheme="cpc">H01L</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00619" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00619</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Forming high aspect ratio structures having deep steep walls</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00626" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00626</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Processes for achieving a desired geometry not provided for in groups <class-ref scheme="cpc">B81C1/00563</class-ref> - <class-ref scheme="cpc">B81C1/00619</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00634" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00634</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Processes for shaping materials not provided for in groups <class-ref scheme="cpc">B81C1/00444</class-ref> - <class-ref scheme="cpc">B81C1/00626</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00642" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00642</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>for improving the physical properties of a device</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0065" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0065</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Mechanical properties</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00658" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00658</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Treatments for improving the stiffness of a vibrating element</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00666" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00666</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Treatments for controlling internal stress or strain in MEMS structures</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00674" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00674</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Treatments for improving wear resistance</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00682" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00682</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Treatments for improving mechanical properties, not provided for in <class-ref scheme="cpc">B81C1/00658</class-ref> - <class-ref scheme="cpc">B81C1/0065</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0069" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0069</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Thermal properties, e.g. improve thermal insulation</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00698" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00698</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Electrical characteristics, e.g. by doping materials</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00706" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00706</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Magnetic properties</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00714" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00714</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Treatment for improving the physical properties not provided for in groups <class-ref scheme="cpc">B81C1/0065</class-ref> - <class-ref scheme="cpc">B81C1/00706</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00777" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00777</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Preserve existing structures from alteration, e.g. temporary protection during manufacturing</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00785" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00785</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching </text><reference><text><class-ref scheme="cpc">B81C1/00563</class-ref> - <class-ref scheme="cpc">B81C1/00595</class-ref> take precedence</text></reference></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00793" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00793</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Avoid contamination, e.g. absorption of impurities or oxidation</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00801" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00801</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer </text><reference><text><class-ref scheme="cpc">B81C1/00595</class-ref>, <class-ref scheme="cpc">B81C1/00468</class-ref> take precedence</text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00809" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00809</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Methods to avoid chemical alteration not provided for in groups <class-ref scheme="cpc">B81C1/00793</class-ref> - <class-ref scheme="cpc">B81C1/00801</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00817" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00817</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Avoid thermal destruction</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00825" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00825</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Protect against mechanical threats, e.g. against shocks, or residues </text><reference><text><class-ref scheme="cpc">B81C1/00261</class-ref> take precedence</text></reference></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00833" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00833</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Methods for preserving structures not provided for in groups <class-ref scheme="cpc">B81C1/00785</class-ref> - <class-ref scheme="cpc">B81C1/00825</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00841" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00841</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Cleaning during or after manufacture </text><reference><text>cleaning of semiconductor devices <class-ref scheme="cpc">H01L21/306</class-ref></text></reference></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00849" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00849</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>during manufacture</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00857" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00857</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>after manufacture, e.g. back-end of the line process</text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00865" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00865</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Multistep processes for the separation of wafers into individual elements</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00873" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00873</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>characterised by special arrangements of the devices, allowing an easier separation</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0088" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0088</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Separation allowing recovery of the substrate or a part of the substrate, e.g. epitaxial lift-off</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00888" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00888</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00896" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00896</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Temporary protection during separation into individual elements</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00904" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00904</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Multistep processes for the separation of wafers into individual elements not provided for in groups <class-ref scheme="cpc">B81C1/00873</class-ref> - <class-ref scheme="cpc">B81C1/00896</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C1/00912" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00912</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Treatments or methods for avoiding stiction of flexible or moving parts of MEMS</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0092" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0092</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>For avoiding stiction during the manufacturing process of the device, e.g. during wet etching</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00928" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00928</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Eliminating or avoiding remaining moisture after the wet etch release of the movable structure</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00936" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00936</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Releasing the movable structure without liquid etchant</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00944" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00944</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Maintaining a critical distance between the structures to be released</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00952" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00952</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups <class-ref scheme="cpc">B81C1/00928</class-ref> - <class-ref scheme="cpc">B81C1/00944</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/0096" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/0096</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>For avoiding stiction when the device is in use, i.e. after manufacture has been completed</text></CPC-specific-text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00968" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00968</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Methods for breaking the stiction bond</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00976" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C1/00976</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Control methods for avoiding stiction, e.g. controlling the bias voltage</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="10" additional-only="false" sort-key="B81C1/00984" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00984</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Methods for avoiding stiction when the device is in use not provided for in groups <class-ref scheme="cpc">B81C1/00968</class-ref> - <class-ref scheme="cpc">B81C1/00976</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C1/00992" definition-exists="false" ipc-concordant="B81C1/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C1/00992</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Treatments or methods for avoiding stiction of flexible or moving parts of MEMS not provided for in groups <class-ref scheme="cpc">B81C1/0092</class-ref> - <class-ref scheme="cpc">B81C1/00984</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="7" additional-only="false" sort-key="B81C3/00" definition-exists="true" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C3/00</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Assembling of devices or systems from individually processed components</text></title-part></class-title>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C3/001" definition-exists="false" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C3/001</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Bonding of two components</text></CPC-specific-text></title-part></class-title></classification-item>
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<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C3/002" definition-exists="false" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C3/002</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Aligning microparts</text></CPC-specific-text></title-part></class-title>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C3/004" definition-exists="false" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C3/004</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Active alignment, i.e. moving the elements in response to the detected position of the elements using internal or external actuators</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C3/005" definition-exists="false" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C3/005</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C3/007" definition-exists="false" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C3/007</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Methods for aligning microparts not provided for in groups <class-ref scheme="cpc">B81C3/004</class-ref> - <class-ref scheme="cpc">B81C3/005</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C3/008" definition-exists="false" ipc-concordant="B81C3/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C3/008</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Aspects related to assembling from individually processed components, not covered by groups <class-ref scheme="cpc">B81C3/001</class-ref> - <class-ref scheme="cpc">B81C3/002</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="7" additional-only="false" sort-key="B81C99/00" definition-exists="true" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/00</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Subject matter not provided for in other groups of this subclass</text></title-part></class-title>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C99/0005" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C99/0005</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same</text></CPC-specific-text></title-part></class-title>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/001" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/001</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>for cutting, cleaving or grinding</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/0015" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2019-02-01" status="published"><classification-symbol>B81C99/0015</classification-symbol><class-title date-revised="2019-02-01"><title-part><CPC-specific-text><text>for microextrusion </text><reference><text>extrusion heads in general <class-ref scheme="cpc">B29C48/30</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/002" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C99/002</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Apparatus for assembling MEMS, e.g. micromanipulators </text><reference><text>micromanipulators <u>per se</u> <class-ref scheme="cpc">B25J7/00</class-ref></text></reference></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/0025" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C99/0025</classification-symbol><class-title date-revised="2017-08-01"><title-part><CPC-specific-text><text>Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in <class-ref scheme="cpc">B81C99/001</class-ref> - <class-ref scheme="cpc">B81C99/002</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C99/003" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/003</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Characterising MEMS devices, e.g. measuring and identifying electrical or mechanical constants</text></CPC-specific-text></title-part></class-title></classification-item>
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|
<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C99/0035" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/0035</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Testing</text></CPC-specific-text></title-part></class-title>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/004" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/004</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>during manufacturing</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/0045" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/0045</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>End test of the packaged device</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/005" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/005</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Test apparatus</text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C99/0055" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/0055</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Manufacturing logistics</text></CPC-specific-text></title-part></class-title>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/006" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/006</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Design; Simulation</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/0065" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/0065</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Process control; Yield prediction</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/007" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/007</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Marking</text></CPC-specific-text></title-part></class-title></classification-item></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="8" additional-only="false" sort-key="B81C99/0075" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/0075</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Manufacture of substrate-free structures</text></CPC-specific-text></title-part></class-title>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/008" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/008</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>separating the processed structure from a mother substrate</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/0085" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/0085</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>using moulds and master templates, e.g. for hot-embossing</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/009" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C99/009</classification-symbol><class-title date-revised="2013-01-01"><title-part><CPC-specific-text><text>Manufacturing the stamps or the moulds</text></CPC-specific-text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="false" not-allocatable="false" level="9" additional-only="false" sort-key="B81C99/0095" definition-exists="false" ipc-concordant="B81C99/00" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C99/0095</classification-symbol><class-title date-revised="2016-05-01"><title-part><CPC-specific-text><text>Aspects relating to the manufacture of substrate-free structures, not covered by groups <class-ref scheme="cpc">B81C99/008</class-ref> - <class-ref scheme="cpc">B81C99/009</class-ref></text></CPC-specific-text></title-part></class-title></classification-item></classification-item></classification-item></classification-item>
|
|
<classification-item breakdown-code="true" not-allocatable="true" level="6" additional-only="true" sort-key="B81C201/00" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/00</classification-symbol>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="7" additional-only="true" sort-key="B81C201/00" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C2201/00</classification-symbol><class-title date-revised="2017-08-01"><title-part><text>Manufacture or treatment of microstructural devices or systems</text></title-part></class-title>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C201/01" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/01</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>in or on a substrate</text></title-part></class-title>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/0101" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0101</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Shaping material</text></title-part><title-part><text>Structuring the bulk substrate or layers on the substrate</text></title-part><title-part><text>Film patterning</text></title-part></class-title>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0102" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0102</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Surface micromachining</text></title-part></class-title>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0104" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0104</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Chemical-mechanical polishing [CMP]</text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0105" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0105</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Sacrificial layer</text></title-part></class-title>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0107" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0107</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Sacrificial metal</text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0108" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0108</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Sacrificial polymer, ashing of organics</text></title-part></class-title></classification-item>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0109" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0109</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Sacrificial layers not provided for in <class-ref scheme="cpc">B81C2201/0107</class-ref> - <class-ref scheme="cpc">B81C2201/0108</class-ref></text></title-part></class-title></classification-item></classification-item></classification-item>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0111" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0111</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Bulk micromachining</text></title-part></class-title>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0112" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0112</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Bosch process</text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0114" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0114</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Electrochemical etching, anodic oxidation</text></title-part></class-title></classification-item>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0115" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0115</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Porous silicon</text></title-part></class-title></classification-item>
|
|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0116" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0116</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities</text></title-part></class-title></classification-item></classification-item>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0118" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0118</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Processes for the planarization of structures</text></title-part></class-title>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0119" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0119</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>involving only addition of materials, i.e. additive planarization</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0121" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0121</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>involving addition of material followed by removal of parts of said material, i.e. subtractive planarization</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0122" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0122</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Selective addition</text></title-part></class-title></classification-item>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0123" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0123</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Selective removal</text></title-part></class-title></classification-item>
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|
<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0125" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0125</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Blanket removal, e.g. polishing</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0126" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0126</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Processes for the planarization of structures not provided for in <class-ref scheme="cpc">B81C2201/0119</class-ref> - <class-ref scheme="cpc">B81C2201/0125</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0128" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0128</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Processes for removing material</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0129" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0129</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Diamond turning</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/013" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/013</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Etching</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0132" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0132</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0133" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0133</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Wet etching</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0135" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0135</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Controlling etch progression</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="13" additional-only="true" sort-key="B81C201/0136" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0136</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by doping limited material regions</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="13" additional-only="true" sort-key="B81C201/0138" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0138</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Monitoring physical parameters in the etching chamber, e.g. pressure, temperature or gas composition</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="13" additional-only="true" sort-key="B81C201/0139" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0139</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>with the electric potential of an electrochemical etching</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="13" additional-only="true" sort-key="B81C201/014" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/014</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="13" additional-only="true" sort-key="B81C201/0142" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0142</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Processes for controlling etch progression not provided for in <class-ref scheme="cpc">B81C2201/0136</class-ref> - <class-ref scheme="cpc">B81C2201/014</class-ref></text></title-part></class-title></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0143" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0143</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Focussed beam, i.e. laser, ion or e-beam</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0145" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0145</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Spark erosion</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0146" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0146</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Processes for removing material not provided for in <class-ref scheme="cpc">B81C2201/0129</class-ref> - <class-ref scheme="cpc">B81C2201/0145</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0147" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0147</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Film patterning</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0149" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0149</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Forming nanoscale microstructures using auto-arranging or self-assembling material</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/015" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/015</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Imprinting</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0152" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0152</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Step and Flash imprinting, UV imprinting</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="12" additional-only="true" sort-key="B81C201/0153" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0153</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Imprinting techniques not provided for in <class-ref scheme="cpc">B81C2201/0152</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0154" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0154</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>other processes for film patterning not provided for in <class-ref scheme="cpc">B81C2201/0149</class-ref> - <class-ref scheme="cpc">B81C2201/015</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0156" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0156</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Lithographic techniques</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0157" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0157</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Gray-scale mask technology</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0159" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0159</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Lithographic techniques not provided for in <class-ref scheme="cpc">B81C2201/0157</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/016" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/016</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Passivation</text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/0161" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0161</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Controlling physical properties of the material</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0163" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0163</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Controlling internal stress of deposited layers</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0164" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0164</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by doping the layer</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0166" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0166</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by ion implantation</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0167" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0167</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by adding further layers of materials having complementary strains, i.e. compressive or tensile strain</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0169" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0169</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by post-annealing</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/017" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/017</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Methods for controlling internal stress of deposited layers not provided for in <class-ref scheme="cpc">B81C2201/0164</class-ref> - <class-ref scheme="cpc">B81C2201/0169</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0171" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0171</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Doping materials</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0173" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0173</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Thermo-migration of impurities from a solid, e.g. from a doped deposited layer</text></title-part></class-title></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/0174" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0174</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>for making multi-layered devices, film deposition or growing</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0176" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0176</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Chemical vapour Deposition</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0177" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0177</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Epitaxy, i.e. homo-epitaxy, hetero-epitaxy, GaAs-epitaxy</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0178" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0178</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Oxidation</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/018" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/018</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Plasma polymerization, i.e. monomer or polymer deposition</text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0181" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0181</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0183" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0183</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Selective deposition</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0184" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0184</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Digital lithography, e.g. using an inkjet print-head</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0185" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C2201/0185</classification-symbol><class-title date-revised="2017-08-01"><title-part><text>Printing, e.g. microcontact printing</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0187" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0187</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Controlled formation of micro- or nanostructures using a template positioned on a substrate</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0188" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0188</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Selective deposition techniques not provided for in <class-ref scheme="cpc">B81C2201/0184</class-ref> - <class-ref scheme="cpc">B81C2201/0187</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/019" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/019</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Bonding or gluing multiple substrate layers</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0191" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0191</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Transfer of a layer from a carrier wafer to a device wafer</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0192" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0192</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>by cleaving the carrier wafer</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0194" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0194</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>the layer being structured</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C201/0195" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0195</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>the layer being unstructured</text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C201/0197" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/0197</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Processes for making multi-layered devices not provided for in groups <class-ref scheme="cpc">B81C2201/0176</class-ref> - <class-ref scheme="cpc">B81C2201/0192</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/0198" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/0198</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>for making a masking layer</text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C201/03" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/03</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Processes for manufacturing substrate-free structures</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/032" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/032</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>LIGA process</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/034" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/034</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Moulding</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/036" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/036</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Hot embossing</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/038" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2201/038</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Processes for manufacturing substrate-free structures not provided for in <class-ref scheme="cpc">B81C2201/034</class-ref> - <class-ref scheme="cpc">B81C2201/036</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C201/05" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/05</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Temporary protection of devices or parts of the devices during manufacturing</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/053" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/053</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Depositing a protective layers</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/056" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/056</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Releasing structures at the end of the manufacturing process</text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C201/11" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/11</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Treatments for avoiding stiction of elastic or moving parts of MEMS</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/112" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/112</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/115" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/115</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Roughening a surface</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C201/117" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2201/117</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Using supercritical fluid, e.g. carbon dioxide, for removing sacrificial layers</text></title-part></class-title></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="7" additional-only="true" sort-key="B81C203/00" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C2203/00</classification-symbol><class-title date-revised="2017-08-01"><title-part><text>Forming microstructural systems</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C203/01" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/01</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Packaging MEMS</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0109" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0109</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Bonding an individual cap on the substrate</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0118" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0118</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Bonding a wafer on the substrate, i.e. where the cap consists of another wafer</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0127" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0127</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Using a carrier for applying a plurality of packaging lids to the system wafer</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0136" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0136</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Growing or depositing of a covering layer</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0145" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0145</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Hermetically sealing an opening in the lid</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0154" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0154</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Moulding a cap over the MEMS device</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0163" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0163</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Reinforcing a cap, e.g. with ribs</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0172" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0172</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Seals</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0181" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C2203/0181</classification-symbol><class-title date-revised="2017-08-01"><title-part><text>Using microheaters for bonding the lid</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/019" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/019</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>characterised by the material or arrangement of seals between parts</text></title-part></class-title></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C203/03" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/03</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Bonding two components</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/031" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/031</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Anodic bondings</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/032" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/032</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Gluing</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/033" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/033</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Thermal bonding</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/035" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/035</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Soldering</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/036" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/036</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Fusion bonding</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/037" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2203/037</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Thermal bonding techniques not provided for in <class-ref scheme="cpc">B81C2203/035</class-ref> - <class-ref scheme="cpc">B81C2203/036</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/038" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2203/038</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Bonding techniques not provided for in <class-ref scheme="cpc">B81C2203/031</class-ref> - <class-ref scheme="cpc">B81C2203/037</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C203/05" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/05</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Aligning components to be assembled</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/051" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/051</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/052" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/052</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/054" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/054</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/055" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/055</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>using the surface tension of fluid solder to align the elements</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/057" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2203/057</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Passive alignment techniques not provided for in <class-ref scheme="cpc">B81C2203/054</class-ref> - <class-ref scheme="cpc">B81C2203/055</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/058" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2203/058</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Aligning components using methods not provided for in <class-ref scheme="cpc">B81C2203/051</class-ref> - <class-ref scheme="cpc">B81C2203/052</class-ref></text></title-part></class-title></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C203/07" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/07</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Integrating an electronic processing unit with a micromechanical structure</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0707" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0707</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0714" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0714</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Forming the micromechanical structure with a CMOS process</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0721" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0721</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Forming the micromechanical structure with a low-temperature process </text><reference><text><class-ref scheme="cpc">B81C2203/0735</class-ref> takes precedence</text></reference></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0728" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0728</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Pre-CMOS, i.e. forming the micromechanical structure before the CMOS circuit</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0735" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0735</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0742" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0742</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/075" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/075</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>the electronic processing unit being integrated into an element of the micromechanical structure</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0757" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0757</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Topology for facilitating the monolithic integration</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C203/0764" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0764</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Forming the micromechanical structure in a groove</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C203/0771" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0771</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Stacking the electronic processing unit and the micromechanical structure</text></title-part></class-title></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="11" additional-only="true" sort-key="B81C203/0778" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2016-05-01" status="published"><classification-symbol>B81C2203/0778</classification-symbol><class-title date-revised="2016-05-01"><title-part><text>Topology for facilitating the monolithic integration not provided for in <class-ref scheme="cpc">B81C2203/0764</class-ref> - <class-ref scheme="cpc">B81C2203/0771</class-ref></text></title-part></class-title></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="9" additional-only="true" sort-key="B81C203/0785" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0785</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="10" additional-only="true" sort-key="B81C203/0792" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2013-01-01" status="published"><classification-symbol>B81C2203/0792</classification-symbol><class-title date-revised="2013-01-01"><title-part><text>Forming interconnections between the electronic processing unit and the micromechanical structure</text></title-part></class-title></classification-item></classification-item></classification-item></classification-item>
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<classification-item breakdown-code="true" not-allocatable="false" level="7" additional-only="true" sort-key="B81C900/00" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C2900/00</classification-symbol><class-title date-revised="2017-08-01"><title-part><text>Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems</text></title-part></class-title>
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<classification-item breakdown-code="true" not-allocatable="false" level="8" additional-only="true" sort-key="B81C900/02" definition-exists="false" ipc-concordant="CPCONLY" c-set-base-allowed="false" c-set-subsequent-allowed="true" date-revised="2017-08-01" status="published"><classification-symbol>B81C2900/02</classification-symbol><class-title date-revised="2017-08-01"><title-part><text>Microextrusion heads</text></title-part></class-title></classification-item></classification-item></classification-item></classification-item></class-scheme> |