H01CRESISTORSIn this subclass, the term "adjustable" means mechanically adjustable.Variable resistors, the value of which is changed non-mechanically, e.g. by voltage or temperature, are classified in group H01C7/00.In this subclass non-limiting references (in the sense of paragraph 39 of the Guide to the IPC) may still be displayed in the scheme. H01C1/00 H01C1/00Details H01C1/01MountingSupporting H01C1/012the base extending along and imparting rigidity or reinforcement to the resistive element H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00 H01C1/014the resistor being suspended between and being supported by two supporting sections H01C1/016 takes precedence H01C1/016with compensation for resistor expansion or contraction H01C1/02HousingEnclosingEmbeddingFilling the housing or enclosure H01C1/022the housing or enclosure being openable or separable from the resistive element H01C1/024the housing or enclosure being hermetically sealed H01C1/028, H01C1/032, H01C1/034 take precedence H01C1/026with gaseous or vacuum spacing between the resistive element and the housing or casing H01C1/028the resistive element being embedded in insulation with outer enclosing sheath H01C1/03with powdered insulation H01C1/032plural layers surrounding the resistive element H01C1/028 takes precedence H01C1/034the housing or enclosure being formed as coating or mould without outer sheath H01C1/032 takes precedence H01C1/036on wound resistive element H01C1/04Arrangements of distinguishing marks, e.g. colour coding H01C1/06Electrostatic or electromagnetic shielding arrangements H01C1/08Cooling, heating or ventilating arrangements H01C1/082using forced fluid flow H01C1/084using self-cooling, e.g. fins, heat sinks H01C1/12Arrangements of current collectors H01C1/125of fluid contacts H01C1/14Terminals or tapping points or electrodes specially adapted for resistors in general H01RArrangements of terminals or tapping points or electrodes on resistors H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient H01C1/1413Terminals or electrodes formed on resistive elements having negative temperature coefficient H01C1/142the terminals or tapping points being coated on the resistive element H01C1/144the terminals or tapping points being welded or soldered H01C1/146the resistive element surrounding the terminal H01C1/148the terminals embracing or surrounding the resistive element H01C1/142 takes precedence H01C1/16Resistor networks not otherwise provided for H01C3/00Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids H01C3/005Metallic glasses therefor H01C3/02arranged or constructed for reducing self-induction, capacitance or variation with frequency H01C3/04Iron-filament ballast resistorsOther resistors having variable temperature coefficient H01C3/06Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself H01C3/08Dimension or characteristic of resistive element changing gradually or in discrete steps from one terminal to another H01C3/10the resistive element having zig-zag or sinusoidal configuration H01C3/12lying in one plane H01C3/14the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding H01C3/02 - H01C3/12 take precedence H01C3/16including two or more distinct wound elements or two or more winding patterns H01C3/18wound on a flat or ribbon base H01C3/16 takes precedence H01C3/20wound on cylindrical or prismatic base H01C3/16 takes precedence H01C7/00Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material consisting of loose powdered or granular material H01C8/00 ; measuring deformation in a solid state using the change in resistance formed by printed-circuit technique G01B7/20; insulating materials H01B3/00; passive thin-film or thick-film semiconductor or solid state devices H01L27/00; resistors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/20; resistors with a potential-jump barrier or surface barrier, e.g. field effect resistors H01L29/00; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H01L31/00 ; ohmic resistance heating H05B3/00; printed circuits H05K; devices using galvanomagnetic or similar magnetic effects, e.g. magnetic-field-controlled resistors, H10N50/00; devices using superconductivity H10N60/00; solid state devices for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier H10N70/00; bulk negative resistance effect devices H10N80/00 H01C7/001Mass resistors H01C7/003Thick film resistors H01C7/005Polymer thick films H01C7/006Thin film resistors H01C7/008Thermistors H01C7/02 - H01C7/06 take precedence H01C7/02having positive temperature coefficient ceramics C04B H01C7/021formed as one or more layers or coatings H01C7/022mainly consisting of non-metallic substances H01C7/021 takes precedence H01C7/023containing oxides or oxidic compounds, e.g. ferrites H01C7/025Perovskites, e.g. titanates H01C7/026Vanadium oxides or oxidic compounds, e.g. VOx H01C7/027consisting of conducting or semi-conducting material dispersed in a non-conductive organic material H01C7/028consisting of organic substances H01C7/04having negative temperature coefficient thermometers using resistive elements G01K7/16In groups H01C7/043 - H01C7/049, the last place priority rule is applied, i.e. at each hierarchical level, in the absence of an indication to the contrary, classification is made in the last appropriate place. H01C7/041formed as one or more layers or coatings H01C7/042mainly consisting of inorganic non-metallic substances H01C7/041 takes precedence H01C7/043Oxides or oxidic compounds H01C7/044Zinc or cadmium oxide H01C7/045Perovskites, e.g. titanates H01C7/046Iron oxides or ferrites H01C7/047Vanadium oxides or oxidic compounds, e.g. VOx H01C7/048Carbon or carbides H01C7/049mainly consisting of organic or organo-metal substances H01C7/041 takes precedence H01C7/06including means to minimise changes in resistance with changes in temperature H01C7/10voltage responsive, i.e. varistors H01C7/1006Thick film varistors H01C7/1013Thin film varistors H01C7/102Varistor boundary, e.g. surface layers H01C7/12 takes precedence H01C7/105Varistor cores H01C7/12 takes precedence H01C7/108Metal oxide H01C7/112ZnO type H01C7/115Titanium dioxide- or titanate type H01C7/118Carbide, e.g. SiC type H01C7/12Overvoltage protection resistors series resistors structurally associated with spark gaps H01T1/16 H01C7/123Arrangements for improving potential distribution H01C7/126Means for protecting against excessive pressure or for disconnecting in case of failure H01C7/13current responsiveGroups H01C7/02 - H01C7/13 take precedence over groups H01C7/18 - H01C7/22. H01C7/18comprising a plurality of layers stacked between terminals H01C7/20the resistive layer or coating being tapered H01C7/22Elongated resistive element being bent or curved, e.g. sinusoidal, helical H01C8/00Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material H01C8/02Coherers or like imperfect resistors for detecting electromagnetic waves H01C8/04Overvoltage protection resistorsArresters H01C10/00Adjustable resistors H01C10/005Surface mountable, e.g. chip trimmer potentiometer H01C10/02Liquid resistors H01C10/025Electrochemical variable resistors trimming resistors by electrolytic treatment H01C17/2412, H01C17/262 H01C10/04with specified mathematical relationship between movement of resistor actuating means and value of resistance, other than direct proportional relationship H01C10/06adjustable by short-circuiting different amounts of the resistive element H01C10/08with intervening conducting structure between the resistive element and the short-circuiting means, e.g. taps H01C10/10adjustable by mechanical pressure or force H01C10/103by using means responding to magnetic or electric fields, e.g. by addition of magnetisable or piezoelectric particles to the resistive material, or by an electromagnetic actuator H01C10/106on resistive material dispersed in an elastic material H01C10/103 and H01C10/12 take precedence; for electric switches H01H1/029 H01C10/12by changing surface pressure between resistive masses or resistive and conductive masses, e.g. pile type H01C10/14adjustable by auxiliary driving means H01C10/16including plural resistive elements H01C10/18including coarse and fine resistive elements H01C10/20Contact structure or movable resistive elements being ganged H01C10/22resistive element dimensions changing gradually in one direction, e.g. tapered resistive element H01C10/04 takes precedence H01C10/23resistive element dimensions changing in a series of discrete, progressive steps H01C10/24the contact moving along turns of a helical resistive element, or vica versa H01C10/26resistive element moving H01C10/16, H01C10/24 take precedenceGroups H01C10/02 - H01C10/26 take precedence over groups H01C10/28 - H01C10/50. H01C10/28the contact rocking or rolling along resistive element or taps H01C10/30the contact sliding along resistive element H01C10/301consisting of a wire wound resistor H01C10/303the resistor being coated, e.g. lubricated, conductive plastic coated, i.e. hybrid potentiometer H01C10/305consisting of a thick film H01C10/306Polymer thick film, i.e. PTF H01C10/308consisting of a thin film H01C10/32the contact moving in an arcuate path H01C10/34the contact or the associated conducting structure riding on collector formed as a ring or portion thereof H01C10/345the collector and resistive track being situated in 2 parallel planes H01C10/36structurally combined with switching arrangements H01C10/363by axial movement of the spindle, e.g. pull-push switch H01C10/366 takes precedence H01C10/366using an electromagnetic actuator H01C10/38the contact moving along a straight path H01C10/40screw operated H01C10/42the contact bridging and sliding along resistive element and parallel conducting bar or collector H01C10/44the contact bridging and sliding along resistive element and parallel conducting bar or collector H01C10/42 takes precedence H01C10/46Arrangements of fixed resistors with intervening connectors, e.g. taps H01C10/28, H01C10/30 take precedence H01C10/48including contact movable in an arcuate path H01C10/50structurally combined with switching arrangements H01C10/36 takes precedence H01C11/00Non-adjustable liquid resistors H01C13/00Resistors not provided for elsewhere H01C13/02Structural combinations of resistors impedance networks per se H03H H01C17/00Apparatus or processes specially adapted for manufacturing resistors providing fillings for housings or enclosures H01C1/02; reducing insulation surrounding a resistor to powder H01C1/03; manufacture of thermally variable resistors H01C7/02, H01C7/04 H01C17/003using lithography, e.g. photolithography lithographic compositions and processing in general G03F H01C17/006adapted for manufacturing resistor chips H01C17/02adapted for manufacturing resistors with envelope or housing H01C17/04adapted for winding the resistive element H01C17/06adapted for coating resistive material on a base H01C17/065by thick film techniques, e.g. serigraphy H01C17/06506Precursor compositions therefor, e.g. pastes, inks, glass frits H01C17/06513characterised by the resistive component H01C17/0652containing carbon or carbides H01C17/06526composed of metals H01C17/06533composed of oxides H01C17/0654Oxides of the platinum group H01C17/06546Oxides of zinc or cadmium H01C17/06553composed of a combination of metals and oxides H01C17/0656composed of silicides H01C17/0652 takes precedence H01C17/06566composed of borides H01C17/0652 takes precedence H01C17/06573characterised by the permanent binder H01C17/0658composed of inorganic material H01C17/06586composed of organic material H01C17/06593characterised by the temporary binder H01C17/07by resistor foil bonding, e.g. cladding H01C17/075by thin film techniques H01C17/20 takes precedence H01C17/08by vapour deposition H01C17/10by flame spraying H01C17/12by sputtering H01C17/14by chemical deposition H01C17/16using electric current H01C17/18without using electric current H01C17/20by pyrolytic processes H01C17/22adapted for trimming H01C17/23by opening or closing resistor geometric tracks of predetermined resistive values, e.g. snapistors H01C17/232Adjusting the temperature coefficientAdjusting value of resistance by adjusting temperature coefficient of resistance H01C17/235Initial adjustment of potentiometer parts for calibration H01C17/24by removing or adding resistive material H01C17/23, H01C17/232, H01C17/235 take precedence H01C17/2404by charged particle impact, e.g. by electron or ion beam milling, sputtering, plasma etching H01C17/2408by pulsed voltage erosion, e.g. spark erosion H01C17/2412by electrolytic treatment, e.g. electroplating for anodic oxydation H01C17/262 H01C17/2416by chemical etching H01C17/242by laser trimming by laser in general B23K26/351 H01C17/245by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment H01C17/26by converting resistive material H01C17/262by electrolytic treatment, e.g. anodic oxydation H01C17/265by chemical or thermal treatment, e.g. oxydation, reduction, annealing etching H01C17/2416 H01C17/267by passage of voltage pulses or electric current H01C17/28adapted for applying terminals H01C17/281by thick film techniques H01C17/283Precursor compositions therefor, e.g. pastes, inks, glass frits H01C17/285applied to zinc or cadmium oxide resistors H01C17/286applied to TiO₂ or titanate resistors H01C17/288by thin film techniques H01C17/30adapted for baking