H05KPRINTED CIRCUITSCASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUSMANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS This subclass covers: combinations of a radio or television receiver with apparatus having a different main function;
printed circuits structurally associated with non-printed electric components.
In this subclass, the following expression is used with the meaning indicated: "printed circuits" covers all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also covers the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support. In this subclass non-limiting references (in the sense of paragraph 39 of the Guide to the IPC) may still be displayed in the scheme. H05K1/00 H05K1/00Printed circuits H05K1/02Details H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating H05K1/0203Cooling of mounted components H05K1/0272 takes precedence H05K1/0204using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence H05K1/0206by printed thermal vias H05K1/0207using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting H05K1/0212Printed circuits or mounted components having integral heating means H05K1/0213Electrical arrangements not otherwise provided for H05K1/0215Grounding of printed circuits by connection to external grounding means H05K1/0216Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215 H05K1/0218by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors H05K1/0221Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines H05K1/0222for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence H05K1/0224Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence H05K1/0225Single or multiple openings in a shielding, ground or power plane H05K1/0227 takes precedence H05K1/0227Split or nearly split shielding or ground planes H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245 H05K1/023using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16 H05K1/0231Capacitors or dielectric substances H05K1/0233Filters, inductors or a magnetic substance H05K1/0234Resistors or by disposing resistive or lossy substances in or near power planes H05K1/0246 takes precedence H05K1/0236Electromagnetic band-gap structures H05K1/0237High frequency adaptations H05K1/0216 takes precedence H05K1/0239Signal transmission by AC coupling H05K1/024Dielectric details, e.g. changing the dielectric material around a transmission line H05K1/0242Structural details of individual signal conductors, e.g. related to the skin effect H05K1/0243Printed circuits associated with mounted high frequency components H05K1/0245Lay-out of balanced signal pairs, e.g. differential lines or twisted lines H05K1/0246Termination of transmission lines H05K1/0248Skew reduction or using delay lines H05K1/025Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66 H05K1/0251related to vias or transitions between vias and transmission lines H05K1/0253Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079; Arrangements for regulating voltages or for using plural voltages H05K1/0256Electrical insulation details, e.g. around high voltage areas H05K1/0257Overvoltage protection H05K1/0259Electrostatic discharge [ESD] protection H05K1/026Spark gaps H05K1/0262Arrangements for regulating voltages or for using plural voltages H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence H05K1/0265characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections H05K1/0266Marks, test patterns or identification means H05K1/0268for electrical inspection or testing H05K1/0269for visual or optical inspection H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion H05K1/0272Adaptations for fluid transport, e.g. channels, holes H05K1/0274Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42 H05K1/0275Security details, e.g. tampering prevention or detection H05K1/0277Bendability or stretchability details H05K1/038, H05K3/4691 take precedence H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material H05K1/028Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence H05K1/0281Reinforcement details thereof H05K1/0283Stretchable printed circuits H05K1/0284Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014 H05K1/0286Programmable, customizable or modifiable circuits by programmable non-printed jumper connections H05K3/222 H05K1/0287having an universal lay-out, e.g. pad or land grid patterns or mesh patterns H05K1/0289having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes H05K1/029having a programmable lay-out, i.e. adapted for choosing between a few possibilities H05K1/0292having a modifiable lay-out, i.e. adapted for engineering changes or repair H05K1/0293 takes precedence H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches H05K1/0295adapted for choosing between different types or different locations of mounted components H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18 H05K1/0298Multilayer circuits H05K1/03Use of materials for the substrate H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass H05K1/0313Organic insulating material H05K1/032consisting of one materialIn this group, in the absence of an indication to the contrary, a material is classified in the last appropriate place H05K1/0326containing O H05K1/0333containing S H05K1/034containing halogen H05K1/0346containing N H05K1/0353consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement H05K1/036Multilayers with layers of different types H05K1/0366reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence H05K1/0373containing additives, e.g. fillers H05K1/036 takes precedence H05K1/038Textiles used as reinforcing materials for organic insulating substrates H05K1/0366 H05K1/0386Paper sheets used as reinforcing materials for organic insulating substrates H05K1/0366 H05K1/0393Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups H05K1/05Insulated conductive substrates, e.g. insulated metal substrate H05K1/053the metal substrate being covered by an inorganic insulating layer H05K1/056the metal substrate being covered by an organic insulating layer H05K1/09Use of materials for the conductive, e.g. metallic pattern H05K1/092Dispersed materials, e.g. conductive pastes or inks H05K1/095for polymer thick films, i.e. having a permanent organic polymeric binder H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence H05K1/11Printed elements for providing electric connections to or between printed circuits H05K1/111Pads for surface mounting, e.g. lay-out H05K1/112directly combined with via connections H05K1/113Via provided in pad; Pad over filled via H05K1/114Pad being close to via, but not surrounding the via H05K1/115Via connections; Lands around holes or via connections H05K1/112 takes precedence H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors H05K1/118specially for flexible printed circuits, e.g. using folded portions H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence H05K1/14Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00 H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit H05K1/144Stacked arrangements of planar printed circuit boards H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules H05K1/147at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means H05K1/16incorporating printed electric components, e.g. printed resistor, capacitor, inductor H05K1/162incorporating printed capacitors H05K1/165incorporating printed inductors H05K1/167incorporating printed resistors H05K1/18Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence H05K1/181associated with surface mounted components H05K1/182associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC] H05K1/183Components mounted in and supported by recessed areas of the printed circuit board H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00 H05K1/186manufactured by mounting on or connecting to patterned circuits before or during embedding H05K1/187the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier H05K1/188manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component H05K1/189characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence H05K3/00Apparatus or processes for manufacturing printed circuits H05K3/0002for manufacturing artworks for printed circuits H05K3/0005for designing circuits by computer H05K3/0008for aligning or positioning of tools relative to the circuit board H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015 H05K3/0011Working of insulating substrates or insulating layers H05K3/0014Shaping of the substrate, e.g. by moulding H05K3/0017Etching of the substrate by chemical or physical means H05K3/002by liquid chemical etching H05K3/0023by exposure and development of a photosensitive insulating layer H05K3/0026by laser ablation H05K3/0029of inorganic insulating material H05K3/0032of organic insulating material H05K3/0035of blind holes, i.e. having a metal layer at the bottom H05K3/0038combined with laser drilling through a metal layer H05K3/0041by plasma etching H05K3/0044Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence H05K3/0047Drilling of holes H05K3/005Punching of holes H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards H05K3/0055After-treatment, e.g. cleaning or desmearing of holes H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence H05K3/0061onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20 H05K3/0064onto a polymeric substrate H05K3/0067onto an inorganic, non-metallic substrate H05K3/007Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces H05K3/0076characterised by the composition of the mask H05K3/0079characterised by the method of application or removal of the mask H05K3/0091 takes precedence H05K3/0082characterised by the exposure method of radiation-sensitive masks H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K13/00 H05K3/0088for treatment of holes H05K3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence H05K3/02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates H05K3/025by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper H05K3/027the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles H05K3/04the conductive material being removed mechanically, e.g. by punching H05K3/041by using a die for cutting the conductive material H05K3/043by using a moving tool for milling or cutting the conductive material H05K3/045by making a conductive layer having a relief pattern, followed by abrading of the raised portions H05K3/046by selective transfer or selective detachment of a conductive layer H05K3/048using a lift-off resist pattern or a release layer pattern H05K3/06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108 H05K3/061Etching masks H05K3/062consisting of metals or alloys or metallic inorganic compounds H05K3/065 takes precedence H05K3/064Photoresists H05K3/065applied by electrographic, electrophotographic or magnetographic methods H05K3/067Etchants H05K3/068Apparatus for etching printed circuits H05K3/07being removed electrolytically H05K3/08the conductive material being removed by electric discharge, e.g. by spark erosion H05K3/10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern H05K3/101by casting or moulding of conductive material H05K3/102by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence H05K3/103by bonding or embedding conductive wires or strips H05K3/105by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam H05K3/106by photographic methods H05K3/107by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence H05K3/108by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241 H05K3/12using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns H05K3/1208Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns providing shape patterns H05K3/1258; adhesion treatments H05K3/38 H05K3/1216by screen printing or stencil printing H05K3/1225Screens or stencils; Holders therefor H05K3/1233Methods or means for supplying the conductive material and for forcing it through the screen or stencil H05K3/1241by ink-jet printing or drawing by dispensing H05K3/125by ink-jet printing H05K3/1258by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern H05K3/1266by electrographic or magnetographic printing H05K3/1275by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods H05K3/1291Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets H05K3/14using spraying techniques to apply the conductive material , e.g. vapour evaporation H05K3/143Masks therefor H05K3/048 takes precedence H05K3/146By vapour deposition H05K3/16by cathodic sputtering H05K3/18using precipitation techniques to apply the conductive material H05K3/181by electroless plating adhesives therefor H05K3/387 H05K3/182characterised by the patterning method H05K3/184using masks H05K3/185by making a catalytic pattern by photo-imaging H05K3/187means therefor, e.g. baths, apparatus H05K3/188by direct electroplating H05K3/20by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence H05K3/202using self-supporting metal foil pattern H05K3/205using a pattern electroplated or electroformed on a metallic carrier H05K3/207using a prefabricated paste pattern, ink pattern or powder pattern H05K3/22Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107 H05K3/222Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685 H05K3/225Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence H05K3/227Drying of printed circuits H05K3/24Reinforcing the conductive pattern by solder coating H05K3/3457 H05K3/241characterised by the electroplating method; means therefor, e.g. baths or apparatus H05K3/242characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated H05K3/243characterised by selective plating, e.g. for finish plating of pads selective plating for making the circuit pattern H05K3/108, H05K3/182 H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473 H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating H05K3/247Finish coating of conductors by using conductive pastes, inks or powders H05K3/248fired compositions for inorganic substrates H05K3/249comprising carbon particles as main constituent H05K3/26Cleaning or polishing of the conductive pattern H05K3/28Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673 H05K3/281by means of a preformed insulating foil H05K3/284 takes precedence H05K3/282for inhibiting the corrosion of the circuit, e.g. for preserving the solderability H05K3/284for encapsulating mounted components H05K1/185 takes precedence H05K3/285Permanent coating compositions H05K3/287Photosensitive compositions H05K3/288Removal of non-metallic coatings, e.g. for repairing H05K3/30Assembling printed circuits with electric components, e.g. with resistor H05K3/301by means of a mounting structure H05K3/325 takes precedence H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence H05K3/305Affixing by adhesive H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means H05K3/32 takes precedence H05K3/308Adaptations of leads connectors to printed circuits H01R12/00 H05K3/32electrically connecting electric components or wires to printed circuits H05K3/321by conductive adhesives H05K3/323by applying an anisotropic conductive adhesive layer over an array of pads H05K3/325by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308 H05K3/326the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence H05K3/328by welding H05K3/34by soldering H05K3/3405Edge mounted components, e.g. terminals H05K3/341Surface mounted components H05K3/3415on both sides of the substrate or combined with lead-in-hole components H05K3/3421Leaded components H05K3/3426characterised by the leads H05K3/3431Leadless components H05K3/3436having an array of bottom contacts, e.g. pad grid array or ball grid array components H05K3/3442having edge contacts, e.g. leadless chip capacitors, chip carriers H05K3/3447Lead-in-hole components H05K3/3415 takes precedence H05K3/3452Solder masks H05K3/3457Solder materials or compositions; Methods of application thereof H05K3/3463Solder compositions in relation to features of the printed circuit board or the mounting process H05K3/3468Applying molten solder H05K3/3473Plating of solder H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns H05K3/3485Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12 H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces H05K3/3494Heating methods for reflowing of solder using integral heating means H05K1/0212 H05K3/36Assembling printed circuits with other printed circuits H05K7/142 takes precedence H05K3/361Assembling flexible printed circuits with other printed circuits H05K3/363by soldering H05K3/365by abutting, i.e. without alloying process H05K3/366substantially perpendicularly to each other H05K3/361 takes precedence H05K3/368parallel to each other H05K3/361 takes precedence H05K3/38Improvement of the adhesion between the insulating substrate and the metal H05K3/381by special treatment of the substrate H05K3/382by special treatment of the metal H05K3/383by microetching H05K3/384by plating H05K3/385by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer H05K3/386by the use of an organic polymeric bonding layer, e.g. adhesive H05K3/387for electroless plating H05K3/4661 takes precedence H05K3/388by the use of a metallic or inorganic thin film adhesion layer H05K3/389by the use of a coupling agent, e.g. silane H05K3/40Forming printed elements for providing electric connections to or between printed circuits H05K3/4007Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457 H05K3/4015using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence H05K3/4038Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence H05K3/4046using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire H05K3/4053by thick-film techniques H05K3/4061for via connections in inorganic insulating substrates H05K3/4069for via connections in organic insulating substrates H05K3/4076by thin-film techniques H05K3/4084by deforming at least one of the conductive layers H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate H05K3/42Plated through-holes or plated via connections H05K3/421Blind plated via connections H05K3/422, H05K3/423 and H05K3/425 take precedence H05K3/422characterised by electroless plating method; pretreatment therefor H05K3/423characterised by electroplating method H05K3/424by direct electroplating H05K3/425characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern H05K3/426initial plating of through-holes in substrates without metal H05K3/427initial plating of through-holes in metal-clad substrates H05K3/428initial plating of through-holes in substrates having a metal pattern H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence H05K3/445having insulated holes or insulated via connections through the metal core H05K3/46Manufacturing multilayer circuits H05K3/4602characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated H05K3/4605made from inorganic insulating material H05K3/4608comprising an electrically conductive base or core H05K3/4611by laminating two or more circuit boards H05K3/4652 takes precedence H05K3/4614the electrical connections between the circuit boards being made during lamination H05K3/4617characterized by laminating only or mainly similar single-sided circuit boards H05K3/462characterized by laminating only or mainly similar double-sided circuit boards H05K3/4623the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence H05K3/4626characterised by the insulating layers or materials H05K3/4688 takes precedence H05K3/4629laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets H05K3/4632laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets H05K3/4635laminating flexible circuit boards using additional insulating adhesive materials between the boards H05K3/4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits H05K3/4641having integrally laminated metal sheets or special power cores H05K3/4644by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602 H05K3/4647by applying an insulating layer around previously made via studs H05K3/465by applying an insulating layer having channels for the next circuit layer H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence H05K3/4655by using a laminate characterized by the insulating layer general-purpose insulating materials H05K1/03, H05K3/4673 H05K3/4658characterized by laminating a prefabricated metal foil pattern, e.g. by transfer H05K3/4661Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387 H05K3/4664Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence H05K3/4667characterized by using an inorganic intermediate insulating layer H05K3/467Adding a circuit layer by thin film methods H05K3/4647 takes precedence H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer similar methods for protective coatings H05K3/28 H05K3/4676Single layer compositions H05K3/4679Aligning added circuit layers or via connections relative to previous circuit layers H05K3/4682Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil H05K3/4685Manufacturing of cross-over conductors H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602 H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers H05K3/4694Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density H05K3/4691 takes precedence H05K3/4697having cavities, e.g. for mounting components H05K3/4691 takes precedence H05K5/00Casings, cabinets or drawers for electric apparatus H05K5/0004comprising several parts forming a closed casing H05K5/0008assembled by screws H05K5/0013assembled by resilient members H05K5/0017with operator interface unitsGroup H05K5/0017 is impacted by reclassification into group H05K5/0018.
Groups H05K5/0017 and H05K5/0018 should be considered in order to perform a complete search. H05K5/0018having an electronic displayGroup H05K5/0018 is incomplete pending reclassification of documents from group H05K5/0017.
Groups H05K5/0017 and H05K5/0018 should be considered in order to perform a complete search. H05K5/0021Side-by-side or stacked arrangements H05K5/0026provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units H05K5/003having an integrally preformed housing H05K5/0034having an overmolded housing covering the PCB H05K5/0039having a tubular housing wherein the PCB is inserted longitudinally H05K5/0043comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing H05K5/0047having a two-part housing enclosing a PCB H05K5/0052characterized by joining features of the housing parts H05K5/0056characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors H05K5/006characterized by features for holding the PCB within the housing H05K5/0065wherein modules are associated together, e.g. electromechanical assemblies, modular structures H05K5/0069having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing H05K5/0073having specific features for mounting the housing on an external structure H05K5/0078specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors H05K5/0082specially adapted for transmission control units, e.g. gearbox controllers H05K5/0086portable, e.g. battery operated apparatus casings for switching devices H01H9/02 H05K5/0091Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00 H05K5/0095hermetically-sealed H05K5/02DetailsGroup H05K5/02 is impacted by reclassification into groups H05K5/0209, H05K5/021, H05K5/0211, H05K5/0212, H05K5/0214, H05K5/0215 and H05K5/0216.
All groups listed in this Warning should be considered in order to perform a complete search. H05K5/0204Mounting supporting structures on the outside of casings H05K5/0208Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof H05K5/0209Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environmentsGroups H05K5/0209 - H05K5/0211 are incomplete pending reclassification of documents from groups H05K5/02 and H05K5/0213.
All groups listed in this Warning should be considered in order to perform a complete search. H05K5/021specially adapted for data recorders, e.g. for flight recorders H05K5/0211Thermal buffers, e.g. latent heat absorbers H05K5/0212Condensation eliminatorsGroup H05K5/0212 is incomplete pending reclassification of documents from groups H05K5/02 and H05K5/0213.
Groups H05K5/02, H05K5/0213 and H05K5/0212 should be considered in order to perform a complete search. H05K5/0213Venting apertures; Constructional details thereofGroup H05K5/0213 is impacted by reclassification into groups H05K5/0209, H05K5/021, H05K5/0211, H05K5/0212, H05K5/0214, H05K5/0215 and H05K5/0216.
All groups listed in this Warning should be considered in order to perform a complete search. H05K5/0214with means preventing penetration of rain water or dust semi-permeable membranes H05K5/0215, H05K5/0216Group H05K5/0214 is incomplete pending reclassification of documents from groups H05K5/02 and H05K5/0213.
Groups H05K5/02, H05K5/0213 and H05K5/0214 should be considered in order to perform a complete search. H05K5/0215with semi-permeable membranes attached to casingsGroup H05K5/0215 is incomplete pending reclassification of documents from groups H05K5/02 and H05K5/0213.
Groups H05K5/02, H05K5/0213 and H05K5/0215 should be considered in order to perform a complete search. H05K5/0216Venting plugs comprising semi-permeable membranesGroup H05K5/0216 is incomplete pending reclassification of documents from groups H05K5/02 and H05K5/0213.
Groups H05K5/02, H05K5/0213 and H05K5/0216 should be considered in order to perform a complete search. H05K5/0217Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03 H05K5/0221Locks; Latches H05K5/0226Hinges H05K5/023Handles; Grips H05K5/0234Feet; Stands; Pedestals, e.g. wheels for moving casing on floor H05K5/0243for decorative purposes H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring H05K5/0252Labels, e.g. for identification, markings or configuration store H05K5/0256of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms H05K5/026having standardized interfaces flash memory cards G06K19/077 H05K5/0265of PCMCIA type H05K5/0269Card housings therefor, e.g. covers, frames, PCB H05K5/0273having extensions for peripherals, e.g. LAN, antennas details of antennas H01Q1/2275 H05K5/0278of USB type details relating to connectors H01R27/00 H05K5/0282Adapters for connecting cards having a first standard in receptacles having a second standard H05K5/0286Receptacles therefor, e.g. card slots, module sockets, card groundings H05K5/0291for multiple cards H05K5/0295having ejection mechanisms H05K5/03Covers H05K5/04Metal casings H05K5/06Hermetically-sealed casings specially adapted for small components H05K5/0095 H05K5/061sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing H05K5/062sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ H05K5/063sealed by a labyrinth structure provided at the joining parts H05K5/064sealed by potting, e.g. waterproof resin poured in a rigid casing H05K5/065sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding H05K5/066sealed by fusion of the joining parts without bringing material; sealed by brazing H05K5/067containing a dielectric fluid H05K5/068having a pressure compensation device, e.g. membrane venting means H05K5/0213 H05K5/069Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft H05K7/00Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00 H05K7/005arrangements of circuit components without supporting structure H05K7/02Arrangements of circuit components or wiring on supporting structure H05K7/023Stackable modules H05K7/026Multiple connections subassemblies H05K7/04on conductive chassis H05K7/06on insulating boards , e.g. wiring harnesses for printed circuits H05K1/18, H05K3/30 H05K7/08on perforated boards H05K7/10Plug-in assemblages of components , e.g. IC sockets H05K7/1007with means for increasing contact pressure at the end of engagement of coupling parts H05K7/1015having exterior leads H05K7/1023co-operating by abutting, e.g. flat pack H05K7/103co-operating by sliding, e.g. DIP carriers H05K7/1038with spring contact pieces H05K7/1046 takes precedence H05K7/1046J-shaped leads H05K7/1053having interior leads H05K7/1061co-operating by abutting H05K7/1069with spring contact pieces H05K7/1076co-operating by sliding H05K7/1084pin grid array package carriers H05K7/1092with built-in components, e.g. intelligent sockets H05K7/12Resilient or clamping means for holding component to structure H05K7/14Mounting supporting structure in casing or on frame or rack H05K7/1401comprising clamping or extracting means H05K7/10 takes precedence H05K7/1402for securing or extracting printed circuit boards H05K7/1404by edge clamping, e.g. wedges H05K7/1405by clips or resilient members, e.g. hooks H05K7/1407by turn-bolt or screw member H05K7/1408by a unique member which latches several boards, e.g. locking bars H05K7/1409by lever-type mechanisms H05K7/1411for securing or extracting box-type drawers H05K7/1412hold down mechanisms, e.g. avionic racks H05K7/1414with power interlock H05K7/1415manual gripping tools H05K7/1417having securing means for mounting boards, plates or wiring boards H05K7/1461 takes precedence H05K7/1418Card guides, e.g. grooves H05K7/1425 takes precedence H05K7/142Spacers not being card guides H05K7/1421Drawers for printed circuit boards H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames H05K7/1424Card cages H05K7/1425of standardised dimensions, e.g. 19"-subrack H05K7/1427Housings H05K7/1428for small modular apparatus with terminal block H05K7/1429for circuits carrying a CPU and adapted to receive expansion cards H05K7/1431Retention mechanisms for CPU modules H05K7/1432specially adapted for power drive units or power convertersGroup H05K7/1432 is impacted by reclassification into groups H05K7/14322, H05K7/14324, H05K7/14325, H05K7/14327, H05K7/14329, H05K7/14337 and H05K7/14339.
All groups listed in this Warning should be considered in order to perform a complete search. H05K7/14322wherein the control and power circuits of a power converter are arranged within the same casingGroup H05K7/14322 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14322 should be considered in order to perform a complete search. H05K7/14324comprising modular units, e.g. DIN rail mounted unitsGroup H05K7/14324 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14324 should be considered in order to perform a complete search. H05K7/14325for cabinets or racksGroup H05K7/14325 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14325 should be considered in order to perform a complete search. H05K7/14327having supplementary functional units, e.g. data transfer modules or displays or user interfacesGroup H05K7/14327 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14327 should be considered in order to perform a complete search. H05K7/14329specially adapted for the configuration of power bus barsGroup H05K7/14329 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14329 should be considered in order to perform a complete search. H05K7/14337specially adapted for underwater operationGroup H05K7/14337 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14337 should be considered in order to perform a complete search. H05K7/14339specially adapted for high voltage operationGroup H05K7/14339 is incomplete pending reclassification of documents from group H05K7/1432.
Groups H05K7/1432 and H05K7/14339 should be considered in order to perform a complete search. H05K7/1434for electronics exposed to high gravitational force; Cylindrical housings H05K7/1435Expandable constructions H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion H05K7/1439Back panel mother boards H05K7/1441with a segmented structure H05K7/1442with a radial structure H05K7/1444Complex or three-dimensional-arrangements; Stepped or dual mother boards H05K7/1445with double-sided connections H05K7/1447External wirings; Wiring ducts; Laying cables H05K7/1448with connections to the front board H05K7/1449with connections to the back board H05K7/1451with connections between circuit boards or units H05K7/1452Mounting of connectors; Switching; Reinforcing of back panels H05K7/1454Alignment mechanisms; Drawout cases H05K7/1455Coding for prevention of wrong insertion H05K7/1457Power distribution arrangements H05K7/1458Active back panels; Back panels with filtering means H05K7/1459Circuit configuration, e.g. routing signals H05K7/1461Slidable card holders; Card stiffeners; Control or display means therefor H05K7/1462for programmable logic controllers [PLC] for automation or industrial process control H05K7/1464Functional units accommodated in the same PLC module housing H05K7/1465Modular PLC assemblies with separable functional units H05K7/1467PLC mounted in a cabinet or chassis H05K7/1468Mechanical features of input/output (I/O) modules H05K7/1469Terminal blocks for connecting sensors H05K7/1471Modules for controlling actuators H05K7/1472Bus coupling modules, e.g. bus distribution modules H05K7/1474Mounting of modules, e.g. on a base or rail or wall H05K7/1475Bus assemblies for establishing communication between PLC modules H05K7/1477including backplanes H05K7/1478including a segmented bus H05K7/1479including decentralized modules, e.g. connected to other modules using fieldbus H05K7/1481User interface, e.g. status displays; Programming interface, e.g. connector for computer programming; Monitoring H05K7/1482PLC power supply; PLC accessories, e.g. for safety H05K7/1484Electrical diagrams relating to constructional features, e.g. signal routing within PLC; Provisions for disaster recovery, e.g. redundant systems H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks H05K7/1487Blade assemblies, e.g. blade cases or inner arrangements within a blade H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures H05K7/1489characterized by the mounting of blades therein, e.g. brackets, rails, trays H05K7/1491 takes precedence H05K7/1491having cable management arrangements management of optical cables G02B6/444; in telecommunication cabinets H04Q1/06 H05K7/1492having electrical distribution arrangements, e.g. power supply or data communications H05K7/1494having hardware for monitoring blades, e.g. keyboards, displays methods or software therefore H05K7/1498 H05K7/1495providing data protection in case of earthquakes, floods, storms, nuclear explosions, intrusions, fire H05K7/1497Rooms for data centers; Shipping containers therefor H05K7/1498Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location thermal management H05K7/20836 H05K7/16on hinges or pivots H05K7/18Construction of rack or frame H05K7/183support rails therefor H05K7/186for supporting telecommunication equipment selecting apparatus H04Q1/02 H05K7/20Modifications to facilitate cooling, ventilating, or heating H05K7/20009using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954 H05K7/20127Natural convection H05K7/20136Forced ventilation, e.g. by fans H05K7/202 takes precedence H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides H05K7/20154Heat dissipaters coupled to components H05K7/20163the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels H05K7/20172Fan mounting or fan specifications H05K7/20181Filters; Louvers H05K7/2019Fan safe systems, e.g. mechanical devices for non stop cooling H05K7/202Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers H05K7/20209Thermal management, e.g. fan control H05K7/20218using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954 H05K7/20236by immersion H05K7/20245by natural convection; Thermosiphons H05K7/20254Cold plates transferring heat from heat source to coolant H05K7/20263Heat dissipaters releasing heat from coolant H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds H05K7/20281Thermal management, e.g. liquid flow control H05K7/2029using a liquid coolant with phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954 H05K7/203by immersion H05K7/20309Evaporators H05K7/20318Condensers H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds H05K7/20336Heat pipes, e.g. wicks or capillary pumps H05K7/20345Sprayers; Atomizers H05K7/20354Refrigerating circuit comprising a compressor H05K7/20363Refrigerating circuit comprising a sorber H05K7/20372Cryogenic cooling; Nitrogen liquid cooling H05K7/20381Thermal management, e.g. evaporation control H05K7/2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00 H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing H05K7/20418the radiating structures being additional and fastened onto the housing H05K7/20427having radiation enhancing surface treatment, e.g. black coating H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing H05K7/20445the coupling element being an additional piece, e.g. thermal standoff H05K7/20454with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste H05K7/20463Filling compound, e.g. potted resin H05K7/20472Sheet interfaces H05K7/20481characterised by the material composition exhibiting specific thermal properties H05K7/2049Pressing means used to urge contact, e.g. springs H05K7/205Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201 H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures H05K7/20518Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots H05K7/20536for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment H05K7/20545Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards H05K7/20554Forced ventilation of a gaseous coolant in closed loop H05K7/206 or H05K7/20609 or H05K7/20618 H05K7/20563within sub-racks for removing heat from electronic boards H05K7/20572within cabinets for removing heat from sub-racks, e.g. plenum H05K7/20581Cabinets including a drawer for fans H05K7/2059within rooms for removing heat from cabinets, e.g. by air conditioning device H05K7/206Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger H05K7/20609Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger H05K7/20618Air circulating in different modes under control of air guidance flaps H05K7/20627Liquid coolant without phase change H05K7/20636within sub-racks for removing heat from electronic boards H05K7/20645within cabinets for removing heat from sub-racks H05K7/20654within rooms for removing heat from cabinets H05K7/20663Liquid coolant with phase change, e.g. heat pipes H05K7/20672within sub-racks for removing heat from electronic boards H05K7/20681within cabinets for removing heat from sub-racks H05K7/2069within rooms for removing heat from cabinets H05K7/207Thermal management, e.g. cabinet temperature control H05K7/20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks H05K7/20718Forced ventilation of a gaseous coolant in closed loop H05K7/20754 H05K7/20727within server blades for removing heat from heat source H05K7/20736within cabinets for removing heat from server blades H05K7/20745within rooms for removing heat from cabinets, e.g. by air conditioning device H05K7/20754Air circulating in closed loop within cabinets H05K7/20763Liquid cooling without phase change H05K7/20772within server blades for removing heat from heat source H05K7/20781within cabinets for removing heat from server blades H05K7/2079within rooms for removing heat from cabinets H05K7/208Liquid cooling with phase change H05K7/20809within server blades for removing heat from heat source H05K7/20818within cabinets for removing heat from server blades H05K7/20827within rooms for removing heat from cabinets, e.g. air conditioning devices H05K7/20836Thermal management, e.g. server temperature control H05K7/20845for automotive electronic casings H05K7/2089 takes precedence H05K7/20854Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence H05K7/20863Forced ventilation, e.g. on heat dissipaters coupled to components H05K7/20872Liquid coolant without phase change H05K7/20881Liquid coolant with phase change H05K7/2089for power electronics, e.g. for inverters for controlling motor H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence H05K7/20909Forced ventilation, e.g. on heat dissipaters coupled to components H05K7/20918the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels H05K7/20927Liquid coolant without phase change H05K7/20936Liquid coolant with phase change H05K7/20945Thermal management, e.g. inverter temperature control H05K7/20954for display panels H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20972 takes precedence H05K7/20972Forced ventilation, e.g. on heat dissipaters coupled to components H05K7/20981Liquid coolant without phase change H05K7/2099Liquid coolant with phase change H05K9/00Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00 H05K9/0001Rooms or chambers anechoic chambers G01R29/0821 H05K9/0003Shielded walls, floors, ceilings, e.g. wallpaper, wall panel, electro-conductive plaster, concrete, cement, mortar H05K9/0005Shielded windows H05K9/0007Casings standardised racks H05K9/0062 H05K9/0009with provisions to reduce EMI leakage through the joining parts H05K9/0015Gaskets or seals H05K9/0016having a spring contact H05K9/0018with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables H05K9/002with localised screening H05K9/0022of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218 H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shieldsGroup H05K9/0024 is impacted by reclassification into groups H05K9/0029 and H05K9/0031.
Groups H05K9/0024, H05K9/0029 and H05K9/0031 should be considered in order to perform a complete search. H05K9/0026integrally formed from metal sheet H05K9/0028with retainers or specific soldering features H05K9/0029made from non-conductive materials intermixed with electro-conductive particles H05K9/0031 takes precedenceGroup H05K9/0029 is incomplete pending reclassification of documents from groups H05K9/0024 and H05K9/003.
All groups listed in this Warning should be considered in order to perform a complete search. H05K9/003made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedenceGroup H05K9/003 is impacted by reclassification into groups H05K9/0029 and H05K9/0031.
Groups H05K9/003, H05K9/0029 and H05K9/0031 should be considered in order to perform a complete search. H05K9/0031combining different shielding materialsGroup H05K9/0031 is incomplete pending reclassification of documents from groups H05K9/0024 and H05K9/003.
All groups listed in this Warning should be considered in order to perform a complete search. H05K9/0032having multiple parts, e.g. frames mating with lids H05K9/0033disposed on both PCB faces H05K9/0035with retainers mounted beforehand on the PCB, e.g. clips H05K9/0037Housings with compartments containing a PCB, e.g. partitioning walls H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218 H05K9/0041Ventilation panels having provisions for screening H05K9/0043being flexible containers, e.g. pouch, pocket, bag H05K9/0045being rigid plastic containers having a coating of shielding material H05K9/0047being rigid plastic containers having conductive particles, fibres or mesh embedded therein H05K9/0049being metallic containers H05K9/005being nesting containers H05K9/0052Shielding other than Faraday cages H05K9/0054specially adapted for display applications H05K9/0056specially adapted for microwave applications H05K9/0058specially adapted for optoelectronic applications H05K9/006specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier H05K9/0062Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications H05K9/0064Earth or grounding circuit H05K9/0066Constructional details of transient suppressor H05K9/0067Devices for protecting against damage from electrostatic discharge H05K9/0069Methods for measuring the shielding efficiency; Apparatus therefor; Isolation container for testing H05K9/0071Active shielding H05K9/0073Shielding materials H05K9/0003 takes precedence H05K9/0075Magnetic shielding materials H05K9/0077comprising superconductors H05K9/0079Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence H05K9/0083comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence H05K9/0084comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition H05K9/0086comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering H05K9/0088comprising a plurality of shielding layers; combining different shielding material structure H05K9/009comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked H05K9/0092comprising electro-conductive pigments, e.g. paint, ink, tampon printing H05K9/0094being light-transmitting, e.g. transparent, translucent H05K9/0096for television displays, e.g. plasma display panel H05K9/0098for shielding electrical cables H05K10/00Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit H05K11/00Combinations of a radio or television receiver with apparatus having a different main function combined with clocks G04B47/00; controlled by a clock G04C21/28 H05K11/02with vehicles H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components H05K13/0007using handtools for mounting on a circuit board H05K13/0447 H05K13/0015Orientation; Alignment; Positioning H05K13/003Placing of components on belts holding the terminals H05K13/0038placing the components in a predetermined order H05K13/0053Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards H05K13/0069Holders for printed circuit boards H05K13/0076Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards H05K13/0084Containers and magazines for components, e.g. tube-like magazines H05K13/0092Treatment of the terminal leads as a separate operation during transport H05K13/0076, H05K13/023; during mounting H05K13/04 H05K13/02Feeding of components H05K13/021Loading or unloading of containers H05K13/028 takes precedence H05K13/0215Interconnecting of containers, e.g. splicing of tapes H05K13/022with orientation of the elements H05K13/023with bending or straightening of the terminal leads H05K13/024Straightening or aligning terminal leads H05K13/025of components having oppositely extending terminal leads H05K13/026of components having terminal leads in side by side relationship, e.g. using combing elements H05K13/027Fluid transport of components H05K13/028Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields H05K13/029Feeding axial lead components, e.g. using vibrating bowls, magnetic fields H05K13/022 takes precedence H05K13/04Mounting of components , e.g. of leadless components H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws H05K13/0406Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping H05K13/0408Incorporating a pick-up tool H05K13/0409Sucking devices H05K13/041having multiple pick-up tools H05K13/0411having multiple mounting heads H05K13/0413with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools H05K13/0417Feeding with belts or tapes H05K13/0419tape feeders H05K13/0421with treatment of the terminal leads H05K13/0426for components being oppositely extending terminal leads H05K13/0421 takes precedence H05K13/043Feeding one by one by other means than belts H05K13/0434with containers H05K13/0439incorporating means for treating the terminal leads only before insertion H05K13/0443incorporating means for treating the terminal leads before and after insertion or only after insertion H05K13/0447Hand tools therefor H05K13/0452Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place H05K13/0406, H05K13/041 take precedence H05K13/0456simultaneously punching the circuit board H05K13/046Surface mounting surface mounted components H05K3/341 H05K13/0465by soldering H05K13/0469 takes precedence H05K13/0469by applying a glue or viscous material H05K13/0473Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board H05K13/0478Simultaneously mounting of different components H05K13/0482using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached H05K13/0486Replacement and removal of components H05K13/0491Hand tools therefor H05K13/0495having a plurality of work-stations H05K13/06Wiring by machine H05K13/065Accessories therefor, e.g. light spots H05K13/08Monitoring manufacture of assemblages H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines H05K13/0812the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement H05K13/0813Controlling of single components prior to mounting, e.g. orientation, component geometry H05K13/0812 takes precedence H05K13/0815Controlling of component placement on the substrate during or after manufacturing H05K13/0817Monitoring of soldering processes inspection of solder joints or of printed solder paste G01N21/95684 H05K13/0818Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts H05K13/082Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays H05K13/083Quality monitoring using results from monitoring devices, e.g. feedback loops H05K13/084 takes precedence H05K13/084Product tracking, e.g. of substrates during the manufacturing process; Component traceability H05K13/085Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level H05K13/0853Determination of transport trajectories inside mounting machines H05K13/0857Product-specific machine setup; Changeover of machines or assembly lines to new product type H05K13/086Supply management, e.g. supply of components or of substrates H05K13/087Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads H05K13/0882Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such H05K13/083 takes precedence H05K13/0885Power supply H05K13/0888Ergonomics; Operator safety; Training; Failsafe systems H05K13/089Calibration, teaching or correction of mechanical systems, e.g. of the mounting head H05K13/0895Maintenance systems or processes, e.g. indicating need for maintenance H05K2201/00 H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00 H05K2201/01Dielectrics H05K2201/0104Properties and characteristics in general H05K2201/0108Transparent H05K2201/0112Absorbing light, e.g. dielectric layer with carbon filler for laser processing H05K2201/0116Porous, e.g. foam H05K2201/012Flame-retardantPreventing of inflammation H05K2201/0125Shrinkable, e.g. heat-shrinkable polymer H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layerShaping of thermoplastic polymer H05K2201/0133Elastomeric or compliant polymer elastomeric conductor H05K2201/0314 H05K2201/0137Materials H05K2201/0141Liquid crystal polymer [LCP] H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] H05K2201/0154Polyimide H05K2201/0158Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP] H05K2201/0162Silicon containing polymer, e.g. silicone H05K2201/0166Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching H05K2201/017Glass ceramic coating, e.g. formed on inorganic substrate inorganic, non-metallic substrates H05K1/0306 H05K2201/0175Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor H05K2201/0179Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor H05K2201/0183Dielectric layers H05K2201/0187with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties H05K2201/0191wherein the thickness of the dielectric plays an important role H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure H05K2201/02FillersParticlesFibersReinforcement materials H05K2201/0203Fillers and particles H05K2201/0206Materials H05K2201/0209Inorganic, non-metallic particles H05K2201/0212Resin particles H05K2201/0215Metallic fillers H05K2201/0218Composite particles, i.e. first metal coated with second metal H05K2201/0221Insulating particles having an electrically conductive coating H05K2201/0224Conductive particles having an insulating coating H05K2201/0227Insulating particles having an insulating coating H05K2201/023Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode H05K2201/0233Deformable particles insulating particles having an electrically conductive coating H05K2201/0221 H05K2201/0236Plating catalyst as filler in insulating material catalytic ink H05K2203/0709 H05K2201/0239Coupling agent for particles using a coupling agent to improve the adhesion between an insulating substrate and a metal H05K3/389 H05K2201/0242Shape of an individual particle H05K2201/0245Flakes, flat particles or lamellar particles H05K2201/0248Needles or elongated particlesElongated cluster of chemically bonded particles microfibers H05K2201/0251; stacked conductors H05K2201/0379 H05K2201/0251Non-conductive microfibers relatively short elongated particles H05K2201/0248 H05K2201/0254Microballoons or hollow filler particles H05K2201/0257Nanoparticles inks comprising nanoparticles H05K1/097 H05K2201/026Nanotubes or nanowires H05K2201/0263Details about a collection of particles H05K2201/0266Size distribution H05K2201/0269Non-uniform distribution or concentration of particles H05K2201/0272Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape H05K2201/0275Fibers and reinforcement materials H05K2201/0278Polymeric fibers H05K2201/0281Conductive fibers H05K2201/0284Paper, e.g. as reinforcement paper sheet substrates H05K1/0386 H05K2201/0287Unidirectional or parallel fibers H05K2201/029Woven fibrous reinforcement or textile textile substrates H05K1/038 H05K2201/0293Non-woven fibrous reinforcement H05K2201/0296Fibers with a special cross-section, e.g. elliptical H05K2201/03Conductive materials H05K2201/0302Properties and characteristics in general H05K2201/0305Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns H05K2201/0308Shape memory alloy [SMA] H05K2201/0311Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact H05K2201/0314Elastomeric connector or conductor, e.g. rubber with metallic filler elastomeric dielectric H05K2201/0133 H05K2201/0317Thin film conductor layerThin film passive component H05K2201/032Materials H05K2201/0323Carbon H05K2201/0326Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO] H05K2201/0329Intrinsically conductive polymer [ICP]Semiconductive polymer H05K2201/0332Structure of the conductor H05K2201/0335Layered conductors or foils H05K2201/0338Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361 H05K2201/0341Intermediate metal, e.g. before reinforcing of conductors by plating H05K2201/0344Electroless sublayer, e.g. Ni, Co, Cd or AgTransferred electroless sublayer H05K2201/0347Overplating, e.g. for reinforcing conductors or bumpsPlating over filled vias reinforcing the conductive pattern H05K3/24 H05K2201/035Paste overlayer, i.e. conductive paste or solder paste over conductive layer H05K2201/0352Differences between the conductors of different layers of a multilayer H05K2201/0355Metal foils H05K2201/0358Resin coated copper [RCC] H05K2201/0361Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched H05K2201/0364Conductor shape H05K2201/0367Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457 H05K2201/037Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides H05K2201/0373Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool providing micro- or nanometer scale roughness on a metal surface H05K2203/0307 H05K2201/0376Flush conductors, i.e. flush with the surface of the printed circuit H05K2201/0379Stacked conductors H05K2201/0382Continuously deformed conductors H05K2201/0385Displaced conductors H05K2201/0388Other aspects of conductors H05K2201/0391Using different types of conductors H05K2201/0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts H05K2201/0397Tab forming integral conductive tabs H05K3/4092 H05K2201/04Assemblies of printed circuits H05K2201/041Stacked PCBs, i.e. having neither an empty space nor mounted components in between H05K2201/042Stacked spaced PCBsPlanar parts of folded flexible circuits having mounted components in between or spaced from each other H05K2201/043Stacked PCBs with their backs attached to each other without electrical connection H05K2201/044Details of backplane or midplane for mounting orthogonal PCBs H05K2201/045Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important H05K2201/046Planar parts of folded PCBs making an angle relative to each other assembling printed circuits perpendicularly to each other H05K3/366 H05K2201/047Box-like arrangements of PCBs H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB H05K2201/049PCB for one component, e.g. for mounting onto mother PCB H05K2201/05Flexible printed circuits [FPCs] H05K2201/051Rolled H05K2201/052Branched H05K2201/053Tails H05K2201/055Folded back on itself H05K2201/056Folded around rigid support or component H05K2201/057Shape retainable H05K2201/058Direct connection between two or more FPCs or between flexible parts of rigid PCBs H05K2201/06Thermal details H05K2201/062Means for thermal insulation, e.g. for protection of parts H05K2201/064Fluid cooling, e.g. by integral pipes H05K2201/066Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416 H05K2201/068wherein the coefficient of thermal expansion is important H05K2201/07Electric details H05K2201/0707Shielding H05K2201/0715provided by an outer layer of PCB H05K2201/0723provided by an inner layer of PCB H05K2201/073High voltage adaptations overvoltage protection H05K1/0257 H05K2201/0738Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials H05K2201/0746Protection against transients, e.g. layout adapted for plugging of connector H05K2201/0753Insulation H05K2201/0761Insulation resistance, e.g. of the surface of the PCB between the conductors H05K2201/0769Anti metal-migration, e.g. avoiding tin whisker growth H05K2201/0776Resistance and impedance H05K2201/0784Uniform resistance, i.e. equalizing the resistance of a number of conductors H05K2201/0792Means against parasitic impedanceMeans against eddy currents H05K2201/08Magnetic details H05K2201/083Magnetic materials H05K2201/086for inductive purposes, e.g. printed inductor with ferrite core H05K2201/09Shape and layout H05K2201/09009Substrate related H05K2201/09018Rigid curved substrate H05K2201/09027Non-rectangular flat PCB, e.g. circular H05K2201/09036Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745 H05K2201/09045Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018 H05K2201/09054Raised area or protrusion of metal substrate H05K2201/09063Holes or slots in insulating substrate not used for electrical connections H05K2201/09072Hole or recess under component or special relationship between hole and component H05K2201/09081Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure H05K2201/0909Preformed cutting or breaking line H05K2201/091Locally and permanently deformed areas including dielectric material H05K2201/09109Locally detached layers, e.g. in multilayer H05K2201/09118Moulded substrate H05K2201/09127PCB or component having an integral separable or breakable part H05K2201/09136Means for correcting warpage H05K2201/09145Edge details H05K2201/09154Bevelled, chamferred or tapered edge H05K2201/09163Slotted edge H05K2201/09172Notches between edge pads H05K2201/09181Notches in edge pads H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes shielding provided by an inner layer of PCB H05K2201/0723 H05K2201/092Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes forming plated-through holes H05K3/42; cutting around hole H05K2203/0242 H05K2201/09209Shape and layout details of conductors H05K2201/09218Conductive traces H05K2201/09227Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting H05K2201/09236Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672 H05K2201/09245Crossing layout alternating conductors H05K2201/097 H05K2201/09254Branched layout H05K2201/09263Meander H05K2201/09272Layout details of angles or corners H05K2201/09281Layout details of a single conductor meander H05K2201/09263; layout details of angles or corners H05K2201/09272 H05K2201/0929Conductive planes H05K2201/093Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224 H05K2201/09309Core having two or more power planesCapacitive laminate of two power planes H05K2201/09318Core having one signal plane and one power plane H05K2201/09327Special sequence of power, ground and signal layers in multilayer PCB H05K2201/09336Signal conductors in same plane as power plane H05K2201/09345Power and ground in the same planePower planes for two voltages in one plane H05K2201/09354Ground conductor along edge of main surface edge contacts H05K3/403 H05K2201/09363wherein only contours around conductors are removed for insulation H05K2201/09372Pads and lands H05K2201/09381Shape of non-curved single flat metallic pad, land or exposed part thereofShape of electrode of leadless component notches in edge pads H05K2201/09181 H05K2201/0939Curved pads, e.g. semi-circular or elliptical pads or lands H05K2201/094Array of pads or lands differing from one another, e.g. in size, pitch, thicknessUsing different connections on the pads using different types of conductors H05K2201/0391 H05K2201/09409Multiple rows of pads, lands, terminals or dummy patternsMultiple rows of mounted components H05K2201/09418Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation H05K2201/09427Special relation between the location or dimension of a pad or land and the location or dimension of a terminal H05K2201/09436Pads or lands on permanent coating which covers the other conductors H05K2201/09445Pads for connections not located at the edge of the PCB, e.g. for flexible circuits H05K2201/09454Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB H05K2201/09463Partial lands, i.e. lands or conductive rings not completely surrounding the hole landless plated-through hole or via H05K2201/09545 H05K2201/09472Recessed pad for surface mounting recess in pad H05K2201/09745Recessed electrode of component H05K2201/09481Via in padPad over filled via if used for surface mounting H05K1/113 H05K2201/0949Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114 H05K2201/095Conductive through-holes or vias H05K2201/09509Blind vias, i.e. vias having one side closed H05K2201/09518Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer H05K2201/09527Inverse blind vias, i.e. bottoms outwards in multilayer PCBBlind vias in centre of PCB having opposed bottoms H05K2201/09536Buried plated through-holes, i.e. plated through-holes formed in a core before lamination H05K2201/09545Plated through-holes or blind vias without lands H05K2201/09554Via connected to metal substrate H05K2201/09563Metal filled via plated through-hole filled with insulating material H05K2201/0959 H05K2201/09572Solder filled plated through-hole in the final product soldering lead-in-hole components H05K3/3447 H05K2201/09581Applying an insulating coating on the walls of holes H05K2201/0959Plated through-holes or plated blind vias filled with insulating material H05K2201/096Vertically aligned vias, holes or stacked vias H05K2201/09609Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378 H05K2201/09618Via fence, i.e. one-dimensional array of vias H05K2201/09627Special connections between adjacent vias, not for grounding vias redundant conductors or connections H05K2201/0979 H05K2201/09636Details of adjacent, not connected vias H05K2201/09645Patterning on via wallsPlural lands around one hole H05K2201/09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095 H05K2201/09663Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254 H05K2201/09672Superposed layout, i.e. in different planes parallel traces in one plane H05K2201/09236 H05K2201/09681Mesh conductors, e.g. as a ground plane H05K2201/0969Apertured conductors H05K2201/097Alternating conductors, e.g. alternating different shaped pads, twisted pairsAlternating components H05K2201/09709Staggered pads, lands or terminalsParallel conductors in different planes H05K2201/09718Clearance holes H05K2201/09727Varying width along a single conductorConductors or pads having different widths H05K2201/09736Varying thickness of a single conductorConductors in the same plane having different thicknesses H05K2201/09745Recess in conductor, e.g. in pad or in metallic substrate H05K2201/09754Connector integrally incorporated in the PCB or in housing mounted connecter H05K2201/10189 H05K2201/09763Printed component having superposed conductors, but integrated in one circuit layer H05K2201/09772Conductors directly under a component but not electrically connected to the component cooling of mounted components by printed thermal vias H05K1/0206 H05K2201/09781Dummy conductors, i.e. not used for normal transport of currentDummy electrodes of components H05K2201/0979Redundant conductors or connections, i.e. more than one current path between two points H05K2201/098Special shape of the cross-section of conductors, e.g. very thick plated conductors H05K2201/09809Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222 H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809 H05K2201/09827Tapered, e.g. tapered hole, via or groove bevelled, chamferred or tapered edge H05K2201/09154 H05K2201/09836Oblique hole, via or bump H05K2201/09845Stepped hole, via, edge, bump or conductor H05K2201/09854Hole or via having special cross-section, e.g. elliptical H05K2201/09863Concave hole or via H05K2201/09872Insulating conformal coating foil encapsulation H05K2203/1311 H05K2201/09881Coating only between conductors, i.e. flush with the conductors H05K2201/0989Coating free areas, e.g. areas other than pads or lands free of solder resist H05K2201/099Coating over pads, e.g. solder resist partly over pads H05K2201/09909Special local insulating pattern, e.g. as dam around component H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components H05K2201/09927Machine readable code, e.g. bar code H05K2201/09936Marks, inscriptions, etc. for information H05K2201/09945Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads H05K2201/09963Programming circuit by using small elements, e.g. small PCBs H05K2201/09972Partitioned, e.g. portions of a PCB dedicated to different functionsBoundary lines thereforePortions of a PCB being processed separately or differently H05K2201/09981Metallised walls H05K2201/09985Hollow waveguide combined with printed circuit H05K2201/0999Circuit printed on or in housing, e.g. housing as PCBCircuit printed on the case of a componentPCB affixed to housing H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board H05K2201/10007Types of components H05K2201/10015Non-printed capacitor H05K2201/10022Non-printed resistor H05K2201/1003Non-printed inductor H05K2201/10037Printed or non-printed battery H05K2201/10045Mounted network component having plural terminals H05K2201/10053Switch H05K2201/1006Non-printed filter H05K2201/10068Non-printed resonator H05K2201/10075Non-printed oscillator H05K2201/10083Electromechanical or electro-acoustic component, e.g. microphone H05K2201/1009Electromotor H05K2201/10098Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas H05K2201/10106Light emitting diode [LED] H05K2201/10113Lamp H05K2201/10121Optical component, e.g. opto-electronic component H05K2201/10128Display H05K2201/10136Liquid Crystal display [LCD] H05K2201/10143Solar cell H05K2201/10151Sensor H05K2201/10159Memory H05K2201/10166Transistor H05K2201/10174Diode H05K2201/10181Fuse H05K2201/10189Non-printed connector H05K2201/10196Variable component, e.g. variable resistor H05K2201/10204Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning H05K2201/10212Programmable component H05K2201/10219Thermoelectric component H05K2201/10227Other objects, e.g. metallic pieces H05K2201/10234Metallic balls solder balls H05K2203/041 H05K2201/10242Metallic cylinders small solder preforms other than balls H05K2203/0415 H05K2201/1025Metallic discs small solder preforms other than balls H05K2203/0415 H05K2201/10257Hollow pieces of metal, e.g. used in connection between component and PCB H05K2201/10265Metallic coils or springs, e.g. as part of a connection element H05K2201/10272Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors metal strips H05K2201/1028 H05K2201/1028Thin metal strips as connectors or conductors H05K2201/10287Metal wires as connectors or conductors H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB H05K2201/10303Pin-in-hole mounted pins H05K2201/1031Surface mounted metallic connector elements H05K2201/10318Surface mounted metallic pins H05K2201/10325Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support H05K2201/10333Individual female type metallic connector elements H05K2201/1034Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB tab H05K2201/0397 H05K2201/10348Fuzz's as connector elements, i.e. small pieces of metallic fiber to make connection H05K2201/10356Cables H05K2201/10363Jumpers, i.e. non-printed cross-over connections H05K2201/10371Shields or metal cases H05K2201/10378Interposers H05K2201/10386Clip leadsTerminals gripping the edge of a substrate H05K2201/10393Clamping a component by an element or a set of elements H05K2201/10401Eyelets, i.e. rings inserted into a hole through a circuit board H05K2201/10409Screws H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061 H05K2201/10424Frame holders H05K2201/10431Details of mounted components printed components H05K1/16 H05K2201/10439Position of a single component H05K2201/10446Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034 H05K2201/10454Vertically mounted H05K2201/10462Flat component oriented parallel to the PCB surface H05K2201/10469Asymmetrically mounted component H05K2201/10477Inverted H05K2201/10484Obliquely mounted H05K2201/10492Electrically connected to another device mounted components directly electrically connected to each other H05K2201/1053 H05K2201/105Mechanically attached to another device attached components H05K2201/10537 H05K2201/10507Involving several components H05K2201/10515Stacked components H05K2201/10522Adjacent components H05K2201/1053Mounted components directly electrically connected to each other, i.e. not via the PCB H05K2201/10537Attached components H05K2201/10545Related components mounted on both sides of the PCB H05K2201/10553Component over metal, i.e. metal plate in between bottom of component and surface of PCB H05K2201/1056Metal over component, i.e. metal plate over component mounted on or embedded in PCB H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element H05K2201/10575Insulating foil under component permanent spacer or stand-off H05K2201/2036 H05K2201/10583Cylindrically shaped componentFixing means therefore H05K2201/1059Connections made by press-fit insertion H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB H05K2201/10606Permanent holder for component or auxiliary PCB mounted on a PCB clamping a component by an element or a set of elements H05K2201/10393 H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads H05K2201/10621Components characterised by their electrical contacts H05K2201/10628Leaded surface mounted device soldering surface mounted leaded components H05K3/3421 H05K2201/10636Leadless chip, e.g. chip capacitor or resistor H05K2201/10643Disc shaped leadless component H05K2201/10651Component having two leads, e.g. resistor, capacitor H05K2201/10659Different types of terminals for the same component, e.g. solder balls combined with leads H05K2201/10666Plated through-hole for surface mounting on PCB H05K2201/10674Flip chip H05K2201/10681Tape Carrier Package [TCP]Flexible sheet connector H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] H05K2201/10696Single-in-line [SIL] package H05K2201/10704Pin grid array [PGA] H05K2201/10712Via grid array, e.g. via grid array capacitor H05K2201/10719Land grid array [LGA] H05K2201/10727Leadless chip carrier [LCC], e.g. chip-modules for cards H05K2201/10734Ball grid array [BGA]Bump grid array H05K2201/10742Details of leads H05K2201/1075Shape details H05K2201/10757Bent leads H05K2201/10765Leads folded back, i.e. bent with an angle of 180 deg H05K2201/10772Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering H05K2201/1078Leads having locally deformed portion, e.g. for retention H05K2201/10787Leads having protrusions, e.g. for retention or insert stop H05K2201/10795Details of lead tips, e.g. pointed H05K2201/10803Tapered leads, i.e. leads having changing width or diameter H05K2201/1081Special cross-section of a leadDifferent cross-sections of different leadsMatching cross-section, e.g. matched to a land H05K2201/10818Flat leads H05K2201/10825Distorted or twisted flat leads, i.e. deformed by torque H05K2201/10833having a curved or folded cross-section H05K2201/1084Notched leads H05K2201/10848Thinned leads H05K2201/10856Divided leads, e.g. by slot in length direction of lead, or by branching of the lead H05K2201/10863Adaptations of leads or holes for facilitating insertion H05K2201/10871Leads having an integral insert stop H05K2201/10878Means for retention of a lead in a hole H05K2201/10886Other details H05K2201/10893Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator H05K2201/10901Lead partly inserted in hole or via H05K2201/10909Materials of terminal, e.g. of leads or electrodes of components H05K2201/10916Terminals having auxiliary metallic piece, e.g. for soldering H05K2201/10924Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202 H05K2201/10931Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes H05K2201/10939Lead of component used as a connector H05K2201/10946Leads attached onto leadless component after manufacturing the component H05K2201/10954Other details of electrical connections H05K2201/10962Component not directly connected to the PCB H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB H05K2201/10977Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284 H05K2201/10984Component carrying a connection agent, e.g. solder, adhesive soldering leadless components having an array of bottom contacts H05K3/3436; BGA components H05K2201/10734 H05K2201/10992Using different connection materials, e.g. different solders, for the same connection H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 H05K2201/2009Reinforced areas, e.g. for a specific part of a flexible printed circuit H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly H05K2201/2027Guiding means, e.g. for guiding flexible circuits H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545 H05K2201/2045Protection against vibrations H05K2201/2054Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics H05K2201/2063mixed adhesion layer containing metallic/inorganic and polymeric materials H05K2201/2072Anchoring, i.e. one structure gripping into another providing micro- or nanometer scale roughness on a metal surface H05K2203/0307 H05K2201/2081Compound repelling a metal, e.g. solder H05K2201/209Auto-mechanical connection between a component and a PCB or between two PCBs H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00 H05K2203/01Tools for processingObjects used during processing H05K2203/0104for patterning or coating H05K2203/0108Male die used for patterning, punching or transferring H05K2203/0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern H05K2203/0117Pattern shaped electrode used for patterning, e.g. plating or etching H05K2203/0121Patterning, e.g. plating or etching by moving electrode H05K2203/0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes H05K2203/013Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125 H05K2203/0134Drum, e.g. rotary drum or dispenser with a plurality of openings H05K2203/0139Blade or squeegee, e.g. for screen printing or filling of holes H05K2203/0143Using a rollerSpecific shape thereofProviding locally adhesive portions thereon H05K2203/0147Carriers and holders H05K2203/0152Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205 H05K2203/0156Temporary polymeric carrier or foil, e.g. for processing or transferring H05K2203/016Temporary inorganic, non-metallic carrier, e.g. for processing or transferring H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing H05K2203/0169Using a temporary frame during processing H05K2203/0173Template for holding a PCB having mounted components thereon H05K2203/0178Projectile, e.g. for perforating substrate H05K2203/0182Using a temporary spacer element or stand-off during processing H05K2203/0186Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof H05K2203/0191Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound H05K2203/0207Partly drilling through substrate until a controlled depth, e.g. with end-point detection H05K2203/0214Back-up or entry material, e.g. for mechanical drilling H05K2203/0221Perforating H05K2203/0228Cutting, sawing, milling or shearing H05K2203/0235Laminating followed by cutting or slicing perpendicular to plane of the laminateEmbedding wires in an object and cutting or slicing the object perpendicular to direction of the wires H05K2203/0242Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH H05K2203/025Abrading, e.g. grinding or sand blasting deburring, rounding, bevelling or smoothing conductor edges H05K2203/0346 H05K2203/0257Brushing, e.g. cleaning the conductive pattern by brushing or wiping H05K2203/0264Peeling insulating layer, e.g. foil, or separating mask H05K2203/0271Mechanical force other than pressure, e.g. shearing or pulling H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive H05K2203/0285Using ultrasound, e.g. for cleaning, soldering or wet treatment H05K2203/0292Using vibration, e.g. during soldering or screen printing H05K2203/03Metal processing H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites H05K2203/0315Oxidising metal H05K2203/0323Working metal substrate or core, e.g. by etching, deforming H05K2203/033Punching metal foil, e.g. solder foil affixing a prefabricated self-supporting metal foil pattern H05K3/202 H05K2203/0338Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component affixing a prefabricated conductor pattern H05K3/20 H05K2203/0346Deburring, rounding, bevelling or smoothing conductor edges H05K2203/0353Making conductive layer thin, e.g. by etching selective thinning for providing different thickness H05K2203/0369 H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser H05K2203/0369Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist H05K2203/0376Etching temporary metallic carrier substrate H05K2203/0384Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching improvement of the adhesion between an insulating substrate and a metal by special treatment of the metal H05K3/382 H05K2203/04Soldering or other types of metallurgic bonding using molten metal H05K2203/128 H05K2203/0405Solder foil, tape or wire H05K2203/041Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436 H05K2203/0415Small preforms other than balls, e.g. discs, cylinders or pillars H05K2203/042Remote solder depot on the PCB, the solder flowing to the connections from this depot H05K2203/0425Solder powder or solder coated metal powder H05K2203/043Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste H05K2203/0435Metal coated solder, e.g. for passivation of solder balls H05K2203/044Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering H05K2203/0445Removing excess solder on padsremoving solder bridges, e.g. for repairing or reworking H05K2203/045Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing H05K2203/0455PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting H05K2203/046Means for drawing solder, e.g. for removing excess solder from pads H05K2203/0465Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads H05K2203/047Soldering with different solders, e.g. two different solders on two sides of the PCB H05K2203/0475Molten solder just before placing the component H05K2203/048Self-alignment during solderingTerminals, pads or shape of solder adapted therefor H05K2203/0485Tacky flux, e.g. for adhering components during mounting H05K2203/049Wire bonding H05K2203/0495Cold welding H05K2203/05Patterning and lithographyMasksDetails of resist H05K2203/0502Patterning and lithography H05K2203/0505Double exposure of the same photosensitive layer H05K2203/0508Flood exposure H05K2203/0511Diffusion patterning H05K2203/0514Photodevelopable thick film, e.g. conductive or insulating paste H05K2203/0517Electrographic patterning H05K2203/052Magnetographic patterning H05K2203/0522Using an adhesive pattern H05K2203/0525Patterning by phototackifying or by photopatterning adhesive H05K2203/0528Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser H05K2203/0531Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate H05K2203/0534Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member H05K2203/0537Transfer of pre-fabricated insulating pattern H05K2203/054Continuous temporary metal layer over resist, e.g. for selective electroplating H05K2203/0542Continuous temporary metal layer over metal pattern reinforcing the conductive pattern characterised by the electroplating method H05K3/241 H05K2203/0545Pattern for applying drops or pasteApplying a pattern made of drops or paste using thick film techniques to apply conductive material by using a substrate with a shape pattern H05K3/1258 H05K2203/0548Masks H05K2203/0551Exposure mask directly printed on the PCB H05K2203/0554Metal used as mask for etching vias, e.g. by laser ablation H05K2203/0557Non-printed masks H05K2203/056Using an artwork, i.e. a photomask for exposing photosensitive layers H05K2203/0562Details of resist H05K2203/0565Resist used only for applying catalyst, not for plating itself H05K2203/0568Resist used for applying paste, ink or powder H05K2203/0571Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist H05K2203/0574Stacked resist layers used for different processes H05K2203/0577Double layer of resist having the same pattern H05K2203/058Additional resists used for the same purpose but in different areas, i.e. not stacked H05K2203/0582Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist H05K2203/0585Second resist used as mask for selective stripping of first resist H05K2203/0588Second resist used as pattern over first resist H05K2203/0591Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability H05K2203/0594Insulating resist or coating with special shaped edges H05K2203/0597Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating coating over pads H05K2201/09818 H05K2203/06Lamination H05K2203/061of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462 H05K2203/063of preperforated insulating layer H05K2203/065Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB H05K2203/066Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern transferring an insulating pattern H05K2203/0537 H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets H05K2203/07Treatments involving liquids, e.g. plating, rinsing H05K2203/0703Plating H05K2203/0706Inactivating or removing catalyst, e.g. on surface of resist H05K2203/0709Catalytic ink or adhesive for electroless plating catalyst filler H05K2201/0236 H05K2203/0713Plating poison, e.g. for selective plating or for preventing plating on resist H05K2203/0716Metallic plating catalysts, e.g. for direct electroplating of through holesSensitising or activating metallic plating catalysts H05K2203/072Electroless plating, e.g. finish plating or initial plating H05K2203/0723Electroplating, e.g. finish plating H05K2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure H05K2203/073Displacement plating, substitution plating or immersion plating, e.g. for finish plating H05K2203/0733Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls H05K2203/0736Methods for applying liquids, e.g. spraying H05K2203/074Features related to the fluid pressure H05K2203/0743Mechanical agitation of fluid, e.g. during cleaning of the conductive pattern H05K2203/0746Local treatment using a fluid jet, e.g. for removing or cleaning materialProviding mechanical pressure using a fluid jet H05K2203/075Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles H05K2203/0753Reversing fluid direction, e.g. in holes H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving H05K2203/0759Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer H05K2203/0763Treating individual holes or single row of holes, e.g. by nozzle H05K2203/0766Rinsing, e.g. after cleaning or polishing a conductive pattern H05K2203/0769Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure H05K2203/0773Dissolving the filler without dissolving the matrix materialDissolving the matrix material without dissolving the filler H05K2203/0776Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773 H05K2203/0779characterised by the specific liquids involved H05K2203/0783Using solvent, e.g. for cleaningRegulating solvent content of pastes or coatings for adjusting the viscosity H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes H05K2203/0789Aqueous acid solution, e.g. for cleaning or etching H05K2203/0793Aqueous alkaline solution, e.g. for cleaning or etching H05K2203/0796Oxidant in aqueous solution, e.g. permanganate H05K2203/08Treatments involving gases H05K2203/081Blowing of gas, e.g. for cooling or for providing heat during solder reflowing H05K2203/082Suction, e.g. for holding solder balls or components H05K2203/083Evaporation or sublimation of a compound, e.g. gas bubble generating agent H05K2203/085Using vacuum or low pressure H05K2203/086Using an inert gas H05K2203/087Using a reactive gas H05K2203/088Using a vapour or mist, e.g. cleaning using water vapor H05K2203/09Treatments involving charged particles H05K2203/092Particle beam, e.g. using an electron beam or an ion beam H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes H05K2203/097Corona discharge H05K2203/10Using electric, magnetic and electromagnetic fieldsUsing laser light H05K2203/101Using electrical induction, e.g. for heating during soldering H05K2203/102Using microwaves, e.g. for curing ink patterns or adhesive H05K2203/104Using magnetic force, e.g. to align particles or for a temporary connection during processing H05K2203/105Using an electrical fieldSpecial methods of applying an electric potential electroplating H05K2203/0723 H05K2203/107Using laser light shaping a substrate by laser ablation H05K3/0026 H05K2203/108Using a plurality of lasers or laser light with a plurality of wavelengths H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating H05K2203/111Preheating, e.g. before soldering H05K2203/1115Resistance heating, e.g. by current through the PCB conductors or through a metallic mask H05K2203/1121Cooling, e.g. specific areas of a PCB being cooled during reflow soldering details related to cooling of mounted components H05K1/0203 H05K2203/1126Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents H05K2203/1131Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity H05K2203/1136Conversion of insulating material into conductive material, e.g. by pyrolysis H05K2203/1142Conversion of conductive material into insulating material or into dissolvable compound H05K2203/1147Sealing or impregnating, e.g. of pores H05K2203/1152Replicating the surface structure of a sacrificial layer, e.g. for roughening H05K2203/1157Using means for chemical reduction H05K2203/1163Chemical reaction, e.g. heating solder by exothermic reaction oxidising metal H05K2203/0315 H05K2203/1168Graft-polymerization H05K2203/1173Differences in wettability, e.g. hydrophilic or hydrophobic areas H05K2203/1178Means for venting or for letting gases escape H05K2203/1184Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectricsMeans for allowing or controlling underetching H05K2203/1189Pressing leads, bumps or a die through an insulating layer H05K2203/1194Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging H05K2203/12Using specific substances H05K2203/121Metallo-organic compounds H05K2203/122Organic non-polymeric compounds, e.g. oil, wax, thiol using solvent H05K2203/0783 H05K2203/124Heterocyclic organic compounds, e.g. azole, furan H05K2203/125Inorganic compounds, e.g. silver salt H05K2203/127Lubricants, e.g. during drilling of holes H05K2203/128Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder spraying droplets of molten metal H05K2203/1344 H05K2203/13Moulding and encapsulationDeposition techniquesProtective layers H05K2203/1305Moulding and encapsulation H05K2203/1311Foil encapsulation, e.g. of mounted components H05K2203/1316Moulded encapsulation of mounted components H05K2203/1322Encapsulation comprising more than one layer H05K2203/1327Moulding over PCB locally or completely applying non-metallic protective coatings for encapsulating mounted components H05K3/284 H05K2203/1333Deposition techniques, e.g. coating H05K2203/1338Chemical vapour deposition H05K2203/1344Spraying small metal particles or droplets of molten metal H05K2203/135Electrophoretic deposition of insulating material H05K2203/1355Powder coating of insulating material H05K2203/1361Coating by immersion in coating bath applying molten solder H05K3/3468 H05K2203/1366Spraying coating apparatus for coating printed circuit boards using liquid non-metallic coating compositions H05K3/0091 H05K2203/1372Coating by using a liquid wave solder dip coating H05K2203/04 H05K2203/1377Protective layers H05K2203/1383Temporary protective insulating layer H05K2203/1388Temporary protective conductive layer H05K2203/1394Covering open PTHs, e.g. by dry film resist or by metal disc H05K2203/14Related to the order of processing steps H05K2203/1407Applying catalyst before applying plating resist H05K2203/1415Applying catalyst after applying plating resist H05K2203/1423Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit H05K2203/143Treating holes before another process, e.g. coating holes before coating the substrate H05K2203/1438Treating holes after another process, e.g. coating holes after coating the substrate metal used as mask for etching vias H05K2203/0554 H05K2203/1446Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering H05K2203/1453Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors H05K2203/1461Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors H05K2203/1469Circuit made after mounting or encapsulation of the components H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning H05K2203/1484Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components H05K2203/1492Periodical treatments, e.g. pulse plating of through-holes H05K2203/15Position of the PCB during processing H05K2203/1509Horizontally held PCB H05K2203/1518Vertically held PCB H05K2203/1527Obliquely held PCB H05K2203/1536Temporarily stacked PCBs H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path H05K2203/1554Rotating or turning the PCB in a continuous manner H05K2203/1563Reversing the PCB H05K2203/1572Processing both sides of a PCB by the same processProviding a similar arrangement of components on both sidesMaking interlayer connections from two sides H05K2203/1581Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside H05K2203/159Using gravitational forceProcessing against the gravity directionUsing centrifugal force H05K2203/16InspectionMonitoringAligning H05K2203/161Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints patterns for electrical inspection or testing H05K1/0268 H05K2203/163Monitoring a manufacturing process H05K2203/165Stabilizing, e.g. temperature stabilization H05K2203/166Alignment or registrationControl of registration H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment H05K2203/168Wrong mounting prevention H05K2203/17Post-manufacturing processes H05K2203/171Tuning, e.g. by trimming of printed components or high frequency circuits H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing programmable, customizable or modifiable circuits H05K1/0286 H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplatingProcesses for deleting connections H05K2203/176Removing, replacing or disconnecting componentEasily removable component thermal arrangements, e.g. to prevent overheating H05K1/0201 H05K2203/178Demolishing, e.g. recycling, reverse engineering, destroying for security purposesUsing biodegradable materials H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17 H05K2203/302Bending a rigid substrateBreaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278 H05K2203/304Protecting a component during manufacturing H05K2203/306Lifting the component during or after mountingIncreasing the gap between component and PCB H05K2203/308Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs H05K999/00Dummy groups for the purpose of scheme testing, logistics of documents or the like H05K999/00dummy group This group and its subgroups are not> real classification places. They are used only for the purpose of scheme testing, logistics of documents or the like. H05K999/99dummy group